Materion Beryllium Copper Alloy 165 Plate & Rolled Bar; H (TD04) Temper; over 9.5 to 25 mm Thickness (UNS C17000)

Category	Metal , Nonferrous Metal , Beryllium Alloy , Copper Alloy
Manufacturer	Materion Corporation (former Brush Wellman)
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Materion Beryllium Copper Alloy 165 Plate & Rolled Bar; H (TD04) Temper; over 9.5 to 25 mm Thickness (UNS C17000).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Treatment required for max strength: as suppliedTabulated properties apply to products after age hardening. Information supplied by Brush Wellman.Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Physical Properties	Metric	English	Comments
Density	8.41 g/cc	0.304 lb/inÂ³

Mechanical Properties	Metric	English
Hardness, Rockwell B	91 - 102	91 - 102
Tensile Strength, Ultimate	620 - 870 MPa	89900 - 126000 psi
Tensile Strength, Yield	510 - 730 MPa	74000 - 106000 psi
Elongation at Break	8.0 - 20 %	8.0 - 20 %
Modulus of Elasticity	131 GPa	19000 ksi
Machinability	20 %	20 %

Thermal Properties	Metric	English
CTE, linear	17.0 Âµm/m-Â°C @Temperature 20.0 - 200 Â°C	9.44 Âµin/in-Â°F @Temperature 68.0 - 392 Â°F
Thermal Conductivity	105 W/m-K	729 BTU-in/hr-ftÂ²-Â°F
Melting Point	870 - 980 Â°C	1600 - 1800 Â°F
Solidus	870 Â°C	1600 Â°F
Liquidus	980 Â°C	1800 Â°F

Component Elements Properties	Metric	English	Comments
Beryllium, Be	1.6 - 1.79 %	1.6 - 1.79 %
Co + Ni	>= 0.20 %	>= 0.20 %
Co + Ni + Fe	<= 0.60 %	<= 0.60 %
Copper, Cu	98 %	98 %	as balance

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.00000910 - 0.0000115 ohm-cm	0.00000910 - 0.0000115 ohm-cm	15-19% IACS Conductivity

Users viewing this material also viewed the following: