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Master Bond EP30HT High Temperature Resistant Two Component Epoxy System

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30HT High Temperature Resistant Two Component Epoxy System.pdf
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Material Notes:
Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. The EP30HT conforms to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.
Physical Properties Metric English Comments
Viscosity 35000 - 45000 cP

@Temperature 23.0 °C
35000 - 45000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 204 °C
400 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 min

@Temperature 23.0 °C
24.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Clear
Mix Ratio By Weight 100/25
Set-Up Time, minutes 25-35
At Room Temperature
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