Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant

Category	Polymer , Thermoset , Silicone , Silicone, RTV, Encapsulation Grade
Manufacturer	Lord Adhesives
Trade Name	Thermoset™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

LORD Thermosetâ„¢ MS-330 encapsulant is a one component silicone specifically designed for use on high-frequency devices including Bluetooth applications. This silicone encapsulant offers excellent electrical insulation properties ideal for coating and protecting electronic devices on polymeric and ceramic substrates.All information provided by Lord.

Physical Properties	Metric	English	Comments
Specific Gravity	1.04 g/cc	1.04 g/cc
Brookfield Viscosity	15000 - 23000 cP @Temperature 25.0 Â°C	15000 - 23000 cP @Temperature 77.0 Â°F	Spindle CP52 @ 10rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	30 - 35	30 - 35
Modulus of Elasticity	0.0100 GPa	1.45 ksi	DMA

Thermal Properties	Metric	English	Comments
CTE, linear	450 Âµm/m-Â°C	250 Âµin/in-Â°F	Alpha 2; TMA
Glass Transition Temp, Tg	-40.0 Â°C	-40.0 Â°F	TMA

Electrical Properties	Metric	English
Volume Resistivity	1.20e+16 ohm-cm @Temperature 25.0 Â°C	1.20e+16 ohm-cm @Temperature 77.0 Â°F
Dielectric Constant	2.8 @Frequency 1.00e+6 Hz	2.8 @Frequency 1.00e+6 Hz
Dissipation Factor	0.0020 @Frequency 1.00e+6 Hz	0.0020 @Frequency 1.00e+6 Hz

Processing Properties	Metric	English
Cure Time	30.0 - 60.0 min @Temperature 125 Â°C	0.500 - 1.00 hour @Temperature 257 Â°F
Pot Life	10080 min @Temperature 25.0 Â°C	10080 min @Temperature 77.0 Â°F
Gel Time	15.0 min @Temperature 150 Â°C	15.0 min @Temperature 302 Â°F
Shelf Life	6.00 Month @Temperature -30.0 Â°C	6.00 Month @Temperature -22.0 Â°F

Descriptive Properties	Value	Comments
Appearance	Black
Consistency	Liquid

Users viewing this material also viewed the following: