Loctite® CHIPBONDER® 3621 Ultra High Speed, Syringe Dispense

Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3621 CHIPBONDER® Ultra High Speed, Syringe DispenseDesigned for high-speed syringe dispense. Excellent green strength. Improved humidity resistance. Jettable.Rounded dot profile. Process Method:Very high speedSyringe dispensing47,000 DPH capableJettable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)