Loctite® CHIPBONDER® 3618 High Speed, Syringe Dispense

Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3618 CHIPBONDER® High Speed, Syringe DispenseFor high-speed syringe dispense. Excellent green strength. Low moisture pick up. Ideal for pressure-time dispense systems.Peaked dot profile. Process Method:High speedSyringe dispensing40,000 DPH capable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)