Material Notes:
As a sacrificial heat source in soldering and brazing applications, NanoFoil® is ideal for high-temperature applications. NanoFoil becomes a non-functional part of the solder or braze joint, eliminating the need for an oven or furnace and allowing for the use of higher temperature solders.Features:Rapid, controlled, locally applied heat sourceInstantaneous, flux-free soldering and brazing at room temperatureSuitable for use with high-temperature solders or brazesEnables high-strength bonds between most combinations of materialsPb-freeComposition before Reaction - Alternating layers of Ni and AlComposition after Reaction - Ni50Al50Applications:Reaction initiationReaction delayFusesJoining of dissimilar materials in large area formats, such as sputtering targets, armor, and other rigid assembliesSoldering or brazing of temperature-sensitive electronics components or assemblies.Information provided by the manufacturer, Indium Corporation of America.