Category | Polymer , Adhesive , Thermoset , Epoxy |
Manufacturer | ITW Devcon |
Trade Name | 5 minute® |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | ITW Devcon 5 minute® Epoxy, Light Amber.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 10000 cP | 10000 cP | Mixed Viscosity |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Elongation at Break | 1.0 % | 1.0 % | |
Adhesive Bond Strength | 13.1 MPa | 1900 psi | lap shear (bond line thickness of 0.005"); ASTM D1002 |
Tensile Impact Strength | 11.5 kJ/m² | 5.50 ft-lb/in² | |
Peel Strength | 0.351 - 0.526 kN/m | 2.00 - 3.00 pli |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Maximum Service Temperature, Air | 93.3 °C | 200 °F | dry |
Minimum Service Temperature, Air | -40.0 °C | -40.0 °F | dry |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 3.00 - 6.00 min | 0.0500 - 0.100 hour | Working time |
10.0 - 15.0 min | 0.167 - 0.250 hour | Fixture time | |
45.0 - 60.0 min | 0.750 - 1.00 hour | Functional cure |
Descriptive Properties | Value | Comments |
---|---|---|
Mix ratio (Resin:Hardener) | 1:1 |