Hexcel® Redux® 340U(SP) (0.03 psf) Modified epoxy film adhesive for bonding metallic and composite components

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 340U(SP) (0.03 psf) Modified epoxy film adhesive for bonding metallic and composite components.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Redux® 340U(SP) is a high temperature modified epoxy film adhesive curing at 175°C (350°F). It was developed as a low weight film adhesive for space applications. It is suitable for bonding metal to metal, where operating temperatures are experienced up to 200°C (392°F) for short periods, or 180°C (356°F) for continuous operation. Redux® 340U(SP) is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cures in 1 hour at 175°C (350°F); Good hot lap shear performance up to 180°C(356°F); Excellent metal-metal peel properties; Excellent drape and handleability; Good reticulating characteristics; very low volatile content and low outgassing properties; Only available un-supported.Applications: Metal to metal bonding; Composite to composite bonding; Space applications.

Physical Properties	Metric	English	Comments
Outgassing - Total Mass Loss	0.109 %	0.109 %	Recovered Mass Loss (RML), Typical result; ESA PSS-01-702
	1.168 %	1.168 %	Total Mass Loss (TML), Typical result; ESA PSS-01-702
Collected Volatile Condensable Material	0.00 %	0.00 %	ESA PSS-01-702

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Roll Width (in)	39.4
Standard Roll (ft2)	538

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