Hexcel® Redux® 335K Adhesive film for bonding metallic and composite components (0.03 psf)

Redux 335 is a film adhesive curing at 250F. It is available in a range of standard areal weights from 0.015 to 0.06 psf. It is available either unsupported or with knitted and/or matt carrier for additional glueline thickness control.Features: Cures in 60 min at 250°F for optimum properties; Good lap shear performance at temperatures ranging from -67°F to 210°F; Excellent peel properties from -67°F to 180°F; Excellent properties in sandwich structures from -67°F to 180°F; Good performance with 250°F - curing fibre reinforced composites in either co-cure or secondary bonding pocesses; Good drape at temperatures as low as 50°F; Less than 1% volatile content.Applications: Aluminum to aluminum bonding; Fiber-reinforced composite to composite bonding; Aluminum honeycomb sandwich bonding; Aramid honeycomb sandwich bonding.