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Hexcel® Redux® 330MPCU Epoxy film adhesives for the bonding and finishing of composites

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 330MPCU Epoxy film adhesives for the bonding and finishing of composites.pdf
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Material Notes:
Redux 330 is a 350°F curing tough film adhesive which is ideally suited to structural bonding, composite to composite bonding, surface finishing, electromagnetic shielding and lightning strike applications. It is available with knitted nylon, matt nylon and metal foils, in a choice of weights to suit the wide range of applications. Redux 330 has excellent structural bonding performance and exceeds the requirements of BMS-8-245.Areal Weights: 0.05, 0.07 psf.Features: Ideal for composite to composite bonding (no metallic fiber); Suitable for co-cure with 350°F prepreg systems; Good structural performance and service temperature to 270°F; Low volatile content (solventless production process); Excellent environmental resistance; High toughness; Light tack and good drapability; Contains carrier for glueline thickness control and for improved adhesive handling.Applications: Shielding and Lightning Strike Protection Adhesive Foils
Processing Properties Metric English Comments
Shelf Life 6.00 Month

@Temperature -17.8 °C
6.00 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Carrier/Foil Perforated and expanded Copper foil
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