Dow SiLK™ I 260 Semiconductor Dielectric Resin

Category	Polymer
Manufacturer	Dow Chemical
Trade Name	SiLK™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Dow SiLK™ I 260 Semiconductor Dielectric Resin.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with standard IC processing tools in todays fabrications. SiLK™ I 260 is fluorine-free, thus is compatible with Ti and Ta barrier materials.Information provided by Dow

Physical Properties	Metric	English	Comments
Water Absorption	0.24 %	0.24 %	80% R.H.
Thickness	0.260 microns	0.0102 mil	3000 rpm
	0.230 - 0.320 microns	0.00906 - 0.0126 mil	2000-4000 rpm

Mechanical Properties	Metric	English
Tensile Strength, Ultimate	89.0 MPa	12900 psi
Tensile Strength, Yield	60.0 MPa	8700 psi
Tensile Modulus	2.45 GPa	355 ksi

Thermal Properties	Metric	English	Comments
CTE, linear	62.0 µm/m-°C @Temperature 50.0 - 410 °C	34.4 µin/in-°F @Temperature 122 - 770 °F
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
	0.230 W/m-K @Temperature 125 °C	1.60 BTU-in/hr-ft²-°F @Temperature 257 °F
Glass Transition Temp, Tg	>= 490 °C	>= 914 °F
Decomposition Temperature	450 °C	842 °F	1% weight loss per hour

Optical Properties	Metric	English	Comments
Refractive Index	1.63	1.63

Electrical Properties	Metric	English	Comments
Dielectric Constant	2.6 @Frequency 100000 Hz	2.6 @Frequency 100000 Hz
Dielectric Strength	>= 400 kV/mm	>= 10200 kV/in

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