Dow INTEGRAL™ 933 Tough Film for Lamination to Porous Substrates

Category	Polymer , Film , Thermoset
Manufacturer	Dow Chemical
Trade Name	INTEGRAL™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Dow INTEGRAL™ 933 Tough Film for Lamination to Porous Substrates.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

INTEGRAL 933 Adhesive Film has a low melting, high flow adhesive layer that is useful for bonding to substrates such as polyurethane or polyethylene foam, or to non-woven textiles.Information provided by Dow

Physical Properties	Metric	English	Comments
Water Vapor Transmission	62.1 g/m²/day	4.00 g/100 in²/day	at 1 atm; ASTM E96
Thickness	50.8 microns	2.00 mil

Mechanical Properties	Metric	English	Comments
Secant Modulus, MD	0.138 GPa	20.0 ksi	2% Secant; ASTM D882
Secant Modulus, TD	0.145 GPa	21.0 ksi	2% Secant; ASTM D882
Elmendorf Tear Strength, MD	5.12 g/micron	130 g/mil	ASTM D882
Elmendorf Tear Strength, TD	11.8 g/micron	300 g/mil	ASTM D882
Film Tensile Strength at Break, MD	18.6 MPa	2700 psi	ASTM D882
Film Tensile Strength at Break, TD	15.2 MPa	2200 psi	ASTM D882

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