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Devcon Tile Adhesive Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Devcon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Devcon Tile Adhesive Epoxy.pdf
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Material Notes:
Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives.
Physical Properties Metric English Comments
Density 1.44 g/cc
0.0521 lb/in³
Mechanical Properties Metric English Comments
Hardness, Shore D 81
81
ASTM D2240
Tensile Strength, Ultimate 18.2 MPa
2640 psi
ASTM D638
Modulus of Elasticity 5.52 GPa
800 ksi
In Tension; ASTM D638
Flexural Yield Strength 37.8 MPa
5480 psi
ASTM D790
Compressive Yield Strength 59.4 MPa
8620 psi
ASTM D695
Adhesive Bond Strength 19.9 MPa
2890 psi
Adhesive tensile shear strength; ASTM D1002
Thermal Properties Metric English Comments
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
 13.9 µin/in-°F

@Temperature 68.0 °F
 ASTM D696
Thermal Conductivity 0.523 W/m-K
3.62 BTU-in/hr-ft²-°F
ASTM C177
Maximum Service Temperature, Air 93.3 °C
200 °F
Operating Temperature
Shrinkage 0.10 %
0.10 %
During Cure; ASTM D2566
Electrical Properties Metric English Comments
Dielectric Constant 46
46
ASTM D150
Dielectric Strength 12.6 kV/mm
320 kV/in
ASTM D149
Processing Properties Metric English Comments
Processing Temperature 21.1 °C
70.0 °F
Pot Life 120 - 180 min

@Temperature 23.9 °C
 120 - 180 min

@Temperature 75.0 °F
Descriptive Properties Value Comments
Coverage per lb. 76.4 in²
at 1/4 inch thick
Mix Ratio by Volume 1 to 1
resin:hardener
Mix Ratio By Weight 10 to 9
resin:hardener
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