Cytec (Conap) RN-1000 / EA-028 Conapoxy® Resin / Conacure® Hardener

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Cytec
Trade Name
Port	Shanghai port,China
Trade Terms	EXW, FOB, CFR, CIF
Payment Terms	L/C, T/T, PayPal
Download PDF	Cytec (Conap) RN-1000 / EA-028 Conapoxy® Resin / Conacure® Hardener.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) RN-1000 / EA-028 Conapoxy® Resin / Conacure® HardenerAn unfilled, low viscosity casting system recommended for potting and encapsulating resistors, connectors, solenoids, transformers, coils, and other electrical devices.Mix Ratio, Resin/Hardener (by weight): 100/28 Cure Type: Room Temperature

Physical Properties	Metric	English	Comments
Viscosity	500 cP <br>@Temperature 25.0 °C	500 cP <br>@Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	105 °C	221 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 4.00e+12 ohm-cm	<= 4.00e+12 ohm-cm
Dielectric Constant	4.7 <br>@Frequency 1000 Hz	4.7 <br>@Frequency 1000 Hz
Dielectric Strength	13.8 kV/mm	350 kV/in
Dissipation Factor	0.015 <br>@Frequency 1000 Hz	0.015 <br>@Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	1440 min <br>@Temperature 25.0 °C	24.0 hour <br>@Temperature 77.0 °F
Pot Life	30.0 min <br>@Temperature 25.0 °C	30.0 min <br>@Temperature 77.0 °F	100 grams

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