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Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Faster cure speed for shorter cure times in multi-plunger and automolding equipment; Improved wire sweep performance (lower viscosity); Reduced post mold cure times; Improved warp performance
Physical Properties Metric English Comments
Density 1.88 g/cc
0.0679 lb/in³
Viscosity 6000 cP

@Temperature 175 °C
6000 cP

@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 90.0 cm
35.4 in
175°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 83
83
Flexural Strength 68.0 MPa
9860 psi
Flexural Modulus 13.0 GPa
1890 ksi
Thermal Properties Metric English Comments
CTE, linear 14.0 µm/m-°C

@Temperature 20.0 °C
7.78 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 56.0 µm/m-°C

@Temperature 20.0 °C
31.1 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 225 °C
437 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Electrical Resistivity 2.00e+16 ohm-cm
2.00e+16 ohm-cm
Dielectric Constant 3.9

@Frequency 1000 Hz
3.9

@Frequency 1000 Hz
Dielectric Strength 28.0 kV/mm
711 kV/in
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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