Cookson Group Plaskon® S-7LA Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® S-7LA Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices. It offers an alpha particle count of

Physical Properties	Metric	English	Comments
Density	1.82 g/cc	0.0658 lb/in³
Viscosity	17000 cP @Temperature 175 °C	17000 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0037 cm/cm	0.0037 in/in
Spiral Flow	85.0 - 115 cm	33.5 - 45.3 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	75	75
Tensile Strength, Ultimate	62.0 MPa	8990 psi
Flexural Strength	103 MPa	14900 psi
Flexural Modulus	12.0 GPa	1740 ksi

Thermal Properties	Metric	English
CTE, linear	17.0 µm/m-°C @Temperature 20.0 °C	9.44 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	45.0 µm/m-°C @Temperature 20.0 °C	25.0 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	150 °C	302 °F
Flammability, UL94	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in
	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0020 @Frequency 1000 Hz	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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