CEN® Electronic Material CF 200CF919 Polyimide Film

Category	Polymer , Thermoset , Polyimide, TS , Polyimide, Thermoset Film
Manufacturer	CEN® Electronic Material Co.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	CEN® Electronic Material CF 200CF919 Polyimide Film.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

CEN®CF polyimide film is the general CEN®CN film that is coated or laminated on one or both sides with Teflon® FEP fluoropolymer. CEN®CF imparts heat sealability, provides a moisture barrier, and enhances chemical resistance.Applications: require a heat bondable film, or moisture and chemical resistance beyond the capabilities of uncoated CEN®CN films, such as tubing, heater circuits, heat sealable bags, automotive diaphragms and manifolds, magnetic wire, PTC InsulationAll information provided by CEN Electronic Material Co., LTD.

Physical Properties	Metric	English	Comments
Thickness	22.0 - 28.0 microns	0.866 - 1.10 mil	Base; ASTM D374
	47.0 - 53.0 microns	1.85 - 2.09 mil	Total; ASTM D374

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	>= 160 MPa	>= 23200 psi	ASTM D882
Elongation at Yield	>= 45 %	>= 45 %	ASTM D882
Peel Strength	>= 0.240 kN/m	>= 1.37 pli	IPC-TM-650

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+14 ohm	>= 1.00e+14 ohm	ASTM D257
Dielectric Strength	>= 200 kV/mm	>= 5080 kV/in	ASTM D149

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