Material Notes:
AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics.Cure Type: Heat cure or Room TemperatureBenefits:Excellent flowExcellent wetting characteristicsWorks on a wide variety of substrates Mix Ratio by weight: 100:81/Resin:Hardener Substrates: Glass, most metals, and variety of plastics Typical Application: Structural bonding, overhead and vertical applicationsInformation provided by Atom Adhesives