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Aptek 6109-A/B Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Aptek Laboratories
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 6109-A/B Epoxy Encapsulant.pdf
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Material Notes:
Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devicesPart A is blue. Part B is clear to pale yellow.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 1.15 g/cc
0.0415 lb/in³
A Component; ASTM D1475
1.20 g/cc
0.0434 lb/in³
B Component; ASTM D1475
Viscosity 350 cP
350 cP
B Component; Spindle #2; speed 50 rpm; ASTM D1824
20000 cP
20000 cP
A Component; Spindle #5; speed 10 rpm; ASTM D1824
Mechanical Properties Metric English Comments
Hardness, Shore D 82
82
Cured property; ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 99.0 µm/m-°C

@Temperature 20.0 °C
55.0 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
225 µm/m-°C

@Temperature 20.0 °C
125 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg 84.0 °C
183 °F
Cured property; Perkin Elmer TMS-2
Flash Point >= 150 °C
>= 302 °F
B Component; ASTM D92
>= 200 °C
>= 392 °F
A Component; ASTM D92
Optical Properties Metric English Comments
Refractive Index 1.48
1.48
B Component
1.538
1.538
Mixed Liquid
1.57
1.57
A Component
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+14 ohm-cm
>= 1.00e+14 ohm-cm
Cured property; ASTM D257
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.015

@Frequency 1000 Hz
0.015

@Frequency 1000 Hz
Cured property; ASTM D150
Processing Properties Metric English Comments
Processing Temperature 115 °C
239 °F
Cure 8 hrs.
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