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Aptek 2313-PMF Hybrid Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
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Material Notes:
Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during solder reflow operation. High thixotropy/"tack" strength-holds components with minimal "Z" axis movement during cure. Stable viscosity for over 4 hours at RT-ideal for robotics. Low Tg (
Physical Properties Metric English Comments
Density 3.00 g/cc
0.108 lb/in³
ASTM D1475
Mechanical Properties Metric English Comments
Adhesive Bond Strength 2.24 MPa
325 psi
Al-to-Al Lap Shear; Cured property; ASTM D1002
Thermal Properties Metric English Comments
Thermal Conductivity >= 1.50 W/m-K
>= 10.4 BTU-in/hr-ft²-°F
COLORA
Glass Transition Temp, Tg <= -50.0 °C
<= -58.0 °F
Cured property; Perkin Elmer TM-2
Flash Point >= 200 °C
>= 392 °F
ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 0.0030 ohm-cm
0.0030 ohm-cm
Cured property; ASTM D257
Processing Properties Metric English Comments
Processing Temperature 85.0 °C
185 °F
Cure 120 min.
125 °C
257 °F
Cure 30 min.
260 °C
500 °F
Cure 30 sec; through solder reflow process
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