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- Polymer Property : Cure Time = 180 min
Polymer Property : Cure Time = 180 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 180 min @Temperature 93.3 °C, Time 10800 sec |
3.00 hour @Temperature 200 °F, Time 3.00 hour |
|
| Reltek BONDiT™ B-4811 Adhesive, Sealant & Coating System Key Properties: Semi-rigid, high strength.A filled version of B-481 to further increase chemical resistance and electrical properties and to lower shrinkage.Ease of use.Applications: Encapsulate sen.. |
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| Cure Time | 180 - 360 min | 3.00 - 6.00 hour | Anaerobic working strength |
| Permabond UV7141 UV-curable Adhesive Permabond UV7141 is a UV-curable adhesive with a secondary anaerobic cure mechanism. This makes it ideal for bonding materials such as ceramic-coated glass, mirrors, etc. where UV-light cannot penet.. |
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| Cure Time | 180 - 4320 min | 3.00 - 72.0 hour | Average value: 1890 min Grade Count:5 |
| Overview of materials for Silicone, RTV, Encapsulation Grade This property data is a summary of similar materials in the MatWeb database for the category "Silicone, RTV, Encapsulation Grade". Each property range of values reported is minimum and maximum value.. |
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| Cure Time | 180 min @Temperature 170 °C |
3.00 hour @Temperature 338 °F |
|
| Humiseal 1A20 Urethane Conformal Coating Humiseal 1A20 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableUL ApprovedMIL-I-46058C ApprovedPasses thermal shock test (MIL.. |
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| Cure Time | 180 - 240 min | 3.00 - 4.00 hour | Handling strength in 3 to 4 hrs. |
| Fibre Glast 1101 High-Strength General Purpose Epoxy Adhesive Description:#1101 is a light grayish-tan two part epoxy adhesive that was developed especially for difficult bonding problems involving similar or dissimilar materials. #1101 provides excellent adhe.. |
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| Cure Time | 180 min | 3.00 hour | Functional cure |
| ITW Devcon Flexane® Rubber Repair / Castable Urethane Fast Cure, Black Information provided by ITW Devcon |
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| Cure Time | 180 min | 3.00 hour | 1 hr @ 25°C + 2 hrs @ 65°C |
| Tra-Con Tra-Bond 216R02 Quick Set Electrical Insulator TRA-BOND 216R02 is an exceptional epoxy formulation recommended for applications where both quick set-up and a low-viscosity material are required. This clear, two-part, low-viscosity system is easi.. |
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| Cure Time | 180 - 240 min @Temperature 40.0 °C |
3.00 - 4.00 hour @Temperature 104 °F |
|
| Tra-Con Tra-Bond 516H02 Fiber Optic Adhesive TRA-BOND 516H02 is a low viscosity, room temperature or low temperature curing fiber optic adhesive with good stress relief, high adhesion, and low shrinkage upon cure. TRA-BOND 516H02 contains very.. |
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| Cure Time | 180 min @Temperature 80.0 °C |
3.00 hour @Temperature 176 °F |
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| Loctite® 3166 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e.. |
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| Cure Time | 180 min | 3.00 hour | 1 hr @ 25°C + 2 hrs @ 65°C |
| Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon.. |
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| Cure Time | 180 min @Temperature 75.0 °C |
3.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond 724-9 Polyurethane Adhesive TRA-BOND 724-9 premixed and frozen polyurethane adhesive has excellent adhesion and provides strong resilient bonds to a wide variety of substrates including aluminum, solder, nylon, mylar and steel.. |
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| Cure Time | 180 min @Temperature 125 °C |
3.00 hour @Temperature 257 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 17 M 1 Heat Cure Catalyst Emerson & Cuming 17 M 1 Eccobond® Heat Cure CatalystVery high temperature resistance, highest temperature strength, lowest shrink. Non-crystallizing. Long working life. Imparts excellent chemical r.. |
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| Cure Time | 180 min @Temperature 25.0 °C |
3.00 hour @Temperature 77.0 °F |
Full Cure; Steel |
| Loctite® 266 High Temperature/High Strength Threadlocker ThreadlockersInvented by Loctite Corporation as a revolutionary method to lock and seal threaded fasteners, Loctite® Liquid Threadlockers have found wide acceptance in a range of applications--from.. |
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| Cure Time | >= 180 min @Temperature 130 °C |
>= 3.00 hour @Temperature 266 °F |
|
| Cytec (Conap) FR-1200 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Cure Time | >= 180 min @Temperature 130 °C |
>= 3.00 hour @Temperature 266 °F |
|
| Cytec (Conap) RN-1000 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Cure Time | 180 min | 3.00 hour | minimum |
| Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved lo.. |
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| Cure Time | 180 min | 3.00 hour | Initial Set |
| 3M Scotchkote™ FG 512 Epoxy Ceramic Surfacer Scotchkote Epoxy Ceramic Surfacer FG 512 has been specifically developed as a ceramic enhanced epoxy repair coating for resurfacing and reforming metal machinery and equipment, such as pumps, impell.. |
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| Cure Time | 180 min | 3.00 hour | Time to Handling Strength |
| 3M Scotch-Weld™ DP8005 Black Structural Adhesive 3M™ Scotch-Weld™ Structural Plastic Adhesive DP-8005 is a two-part acrylic-based adhesive (10:1 ratio by volume) that can bond many low surface energy plastics, including many grades of polypropyl.. |
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| Cure Time | 180 - 240 min @Temperature 149 °C |
3.00 - 4.00 hour @Temperature 300 °F |
Alternate Cure |
| Aremco Aremco-Bond™ 526N High Performance Epoxide Clear-Amber, 1:1 System for Tough Bonding Applications Also available filled with aluminum oxide (Alumina) or pigments |
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| Cure Time | 180 - 240 min | 3.00 - 4.00 hour | 2-4 hrs Air Set; 3 hrs at 200°F |
| Aremco Pyro-Putty™ 653 High Temperature Ceramic-Metallic Putty, Stainless Filled Ceramic and Stainless-Filled, One-Part, Water Based Paste.For Vertical Surfaces and Applications to 1/2" Thick.Repairs Cast Iron, Steel and Stainless Parts to 2000°F. |
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| Cure Time | 180 min | 3.00 hour | Initial Set |
| 3M Scotchkote™ 60EG 533 Urethane Elastomer Scotchkote Urethane Elastomer 60EG 533 has been specifically developed as an elastomeric repair system with a high degree of flexibility for rebuilding and resurfacing rubber components.Product Feat.. |
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| Cure Time | 180 - 360 min | 3.00 - 6.00 hour | 2-4 hr at 200°F followed by 1-2 hr at 350°F |
| Aremco Cerama-Dip™ 538-N-GRN High Temperature Specialty Ceramic-Inorganic Coating Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available. |
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| Cure Time | 180 min | 3.00 hour | Time to Handling Strength |
| 3M Scotch-Weld™ DP270 Clear Structural Adhesive Rigid potting compound, Non-corrosiveInformation provided by 3M |
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| Cure Time | 180 - 240 min | 3.00 - 4.00 hour | At 300°F plus 1 hrs at 150°F |
| Master Bond Supreme 45HTQ Quartz Filled, Heat Resistant Epoxy Compound Master Bond Polymer Adhesive Supreme 45HTQ is a two component, toughened, quartz filled epoxy compound for high performance structural bonding and casting. It is suitable for applications where long.. |
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