Polymer Property : Cure Time = 1.00 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	<= 1.00 min	<= 0.0167 hour	on metal (Fixture)
ND Industries 600 Methacrylate Resin Activator Activator for structural Adhesives and anaerobics. Solvent free.
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	handling time
Permabond TA436 Toughened Acrylic Adhesive PERMABOND TA436 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. Permabond TA436 is a no-mix system which obtains handling strength..
Cure Time	<= 1.00 min	<= 0.0167 hour	Polycarbonate, fixture time, (low power 4mW lamp)
Permabond UV648 UV-curable Adhesive PERMABOND UV648 is a UV-curing adhesive developed for use on plastics. It has good adhesion to acrylic and contains a long-wavelength photo initiator to allow it to cure through UV-stabilized plasti..
Cure Time	1.00 - 480 min @Temperature 71.1 - 204 °C	0.0167 - 8.00 hour @Temperature 160 - 400 °F	Average value: 71.3 min Grade Count:32
Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val..
Cure Time	1.00 min	0.0167 hour	Tack Free Time
Shin-Etsu Silicones KE-348 Silicone, RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time	1.00 min	0.0167 hour	At 30 mW/cm2
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub..
Cure Time	1.00 min	0.0167 hour	60 sec. @ 180ºC under 200 psi load
Loctite® 3440 1 component Gold/polymer filler Anisotropic Epoxy Adhesive Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a ..
Cure Time	1.00 min	0.0167 hour
Loctite® 392 Rapid Fixture Structural Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Cure Time	1.00 min	0.0167 hour	UV Full Cure in 60 seconds at 75 mW/cm^2
Loctite® 5072 Silicone Chip Coating Conformal CoatingsConformal coatings are thin dielectric coatings that extend the longevity of circuit boards by protecting components and traces from corrosion, shorts, and mechanical damage. Locti..
Cure Time	1.00 min	0.0167 hour	Dry Time
Loctite® 7113 Heptane Base Accelerator Surface PreparersLoctite offers a complete line of surface preparation products to ensure the maximum performance of Loctite® Adhesives and Sealants.Loctite® Accelerators are used to increase the ..
Cure Time	1.00 min	0.0167 hour
Loctite® SpeedBonder™ 326 Fast Fixture Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Cure Time	1.00 - 6.00 min	0.0167 - 0.100 hour	ts2; ASTM D2084
ExxonMobil Exxon™ 2244 Fast Cure Rate Grade Exxon Bromobutyl is a brominated copolymer of isobutylene and isoprene. The product form is offwhite to amber bales.Information provided by ExxonMobil Chemical
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-30 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-31 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-33 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-34 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-36 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-37 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 min	0.0167 hour	Set Time
3M Scotch-Weld™ EZ250060 Polyurethane Reactive (PUR) Easy 250 Wood Adhesive 3M™ Scotch-Weld™ Polyurethane Reactive (PUR) Easy 250 Wood Adhesive is 100% solid, warm temperature applied, moisture curing urethanes. This product bonds well to wood and wood bases surfaces as w..
Cure Time	1.00 min	0.0167 hour	Set Time
3M Scotch-Weld™ TE100 Black Polyurethane Reactive Adhesive 3M™ Scotch-Weld™ Polyurethane Reactive Adhesives are a family of one-component, moisture curing, urethane adhesives. These adhesives are applied warm and bond a wide variety of substrates such as ..
Cure Time	1.00 min	0.0167 hour	Tack-free
3M FIP 1-Step Fire Barrier Rated Foam 3M Fire Barrier Rated Foam (FIP 1-Step), is a smoke, sound, and firestopping foam for wall and floor penetrations. Premium two-part, easy-to-handle formulations. Expands up to five times during inst..
Cure Time	1.00 min	0.0167 hour	Set Time
3M Scotch-Weld™ TS115 HGS Polyurethane Reactive Adhesive 3M™ Scotch-Weld™ Polyurethane Reactive Adhesives are a family of one-component, moisture curing, urethane adhesives. These adhesives are applied warm and bond a wide variety of substrates such as ..
Cure Time	1.00 - 1.50 min @Temperature 150 °C	0.0167 - 0.0250 hour @Temperature 302 °F
Loctite® CHIPBONDER® 3615 High Adhesion, Syringe Dispense Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te..
Cure Time	1.00 - 1.50 min @Temperature 150 °C	0.0167 - 0.0250 hour @Temperature 302 °F
Loctite® CHIPBONDER® 3618 High Speed, Syringe Dispense Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te..
Cure Time	1.00 min	0.0167 hour	at 40 mW/cm^2
Loctite® Nuva-Sil® 5088 Potting Compound Potters and Silicon Light Cure AdhesivesLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 min	0.0167 hour	at 40 mW/cm^2
Loctite® Nuva-Sil® 5091 High Adhesion Potting Potters and Silicon Light Cure AdhesivesLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 min	0.0167 hour	at 70 mW/cm^2
Loctite® Nuva-Sil® 5092 Non-corrosive Potting Silicon Light Cure Adhesives and PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 - 2.67 min	0.0167 - 0.0444 hour	Gelation time
Mitsui MILEX™ RX-2325C Low Silicone Rubber Modified Phenolic Resin (discontinued **) The MILEX™ Family of products is widely featured in brake systems of automobiles made by the top automakers through Mitsui Chemicals' affiliation with leading brake manufacturers. The phenolic ..