Loctite® CHIPBONDER® 3615 High Adhesion, Syringe Dispense

Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3615 CHIPBONDER® High Adhesion, Syringe DispenseFormulated specifically for hard to bond components. Low moisture pick up. Ideal for Archimedes and piston pump dispense systems.Peaked dot profile. Process Method:Medium speedSyringe dispensing18,000 DPH capable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)