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Polymer Property : Cure Time = 0.0167 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| NextGen Adhesives P907-01 Fiber Optic Adhesive Description: NGAC P907-01 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| NextGen Adhesives P907-12 Fiber Optic Adhesive Description: NGAC P907-12 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| NextGen Adhesives P907-30 Optical Assembly Adhesive Description: NGAC P907-30 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.Advantages and Applicat.. |
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| Cure Time | 1.00 - 4.00 min @Temperature 149 - 191 °C |
0.0167 - 0.0667 hour @Temperature 300 - 376 °F |
|
| Lord Adhesives Chemglaze® V004 Polyurethane Coating Chemglaze® V-Line polyurethane coatings are moisture curing aliphatic polyurethane coatings. They are used in product finishing applications on polyvinyl-chloride (PVC) and other plastics where m.. |
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| Cure Time | 1.00 - 1.50 min @Temperature 150 °C |
0.0167 - 0.0250 hour @Temperature 302 °F |
|
| Lord Adhesives CircuitSAFâ„¢ MA-420 Epoxy Surface Mount Adhesive CircuitSAFâ„¢ MA-420 is an epoxy surface mount adhesive that cures rapidly at elevated temperatures and has been designed for use in high speed printed circuit board assembly for the attachment o.. |
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| Cure Time | 1.00 - 3.00 min @Temperature 180 °C |
0.0167 - 0.0500 hour @Temperature 356 °F |
|
| Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po.. |
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| Cure Time | 1.00 - 4.00 min @Temperature 149 - 191 °C |
0.0167 - 0.0667 hour @Temperature 300 - 376 °F |
|
| Lord Adhesives Chemglaze® V300 Polyurethane Coating Chemglaze® V-Line polyurethane coatings are moisture curing aliphatic polyurethane coatings. They are used in product finishing applications on polyvinyl-chloride (PVC) and other plastics where m.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond F123MV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 MV is a fast cure, medium viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminati.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond F253 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mixt.. |
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| Cure Time | 1.00 min @Temperature 175 °C |
0.0167 hour @Temperature 347 °F |
|
| Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Loctite® Varidot™ 3612 Stencil Print Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Loctite® Varidot™ 3617 Stencil Print Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® bra.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics .. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in col.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Dow Corning 3-4222 DIELECTRIC FIRM GEL KIT Two-part, translucent green, firm, fast RT or heat cure, and primerless chemical adhesion.Information provided by Dow Corning |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Atom Adhesives AA-BOND F253 Epoxy Adhesive AA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status.Appearance: Unmixed-Light Yellow; Mixed – Greenish.. |
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| Cure Time | 1.00 min @Temperature 75.0 °C |
0.0167 hour @Temperature 167 °F |
Dry to handle, at 50% humidity and 75°C |
| Blue River Coatings Steel Seal Primer BLUE RIVER COATINGS STEEL SEAL PRIMER is a high quality, single component primer, not requiring any catalyzing agent. STEEL SEAL PRIMER is designed for dip coaters who need a quick, fast drying pain.. |
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| Cure Time | 1.00 min @Temperature 150 °C |
0.0167 hour @Temperature 302 °F |
|
| Loctite® Varidot™ 3616 Stencil Print Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te.. |
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