Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive

LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly. Thermoset MD-140 adhesive is low stress, making it suitable for use with large die.Thermoset MD-140 adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications.All information provided by Lord.