Processing Properties | Metric | English | Comments |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
& Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application .. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-.. |
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Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte.. |