Polymer Property : Thermal Conductivity = 6.25 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.900 W/m-K @Pressure 2.07 MPa	6.25 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL 1401 Conductive Elastomer High performance for non-corrosive environments; soft(45 Shore A) for low closure force where gasket geometry cannot be exploited; low tear strength; no fluid resistance. Molded and ExtrudedRoHS Com..
Thermal Conductivity	0.900 W/m-K @Pressure 2.07 MPa	6.25 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL 6370 Conductive Elastomer Commercial Grade Conductive Elastomer Extrusions. These materials offer excellent cost/performance characteristics for commercial EMI gasket applications. These silicone and fluorosilicone based con..
Thermal Conductivity	0.900 W/m-K @Pressure 2.07 MPa	6.25 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL® 6503 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric..
Thermal Conductivity	0.900 W/m-K	6.25 BTU-in/hr-ft²-°F	ASTM D5470
Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group 2568 AMC Glass fiber-reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, heat resistant up to 500°C for short time - usable for s..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group 2572 AMC Glass fiber reinforced Polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, good abrasion stability, high flame retardance in combin..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group 5563 DAP Glass-fiber reinforced diallyl phthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensiona..
Thermal Conductivity	0.900 - 1.00 W/m-K	6.25 - 6.94 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group RALUPOL® 2100 UP Polyester Organically and inorganically filled polyester molding compound. Low post-shrinkage, very good electrical values, good mechanical strength. This product meets the allowed upper limits for heavy meta..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	DIN 52 612
Raschig Group RALUPOL® 4385 UP Glass-fiber reinforced polyester molding compound. Low mold shrinkage and post-shrinkage, very high arc resistance, very high mechanical values. This product meets the allowed upper limits for heavy..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	DIN 52 612
Raschig Group RALUPOL® 4806 UP Glass-fiber reinforced polyester molding compound. Very low mold shrinkage and post-shrinkage, very good mechanical strength, very good electrical values, better performance values compared to UP 80..
Thermal Conductivity	0.900 W/m-K	6.25 BTU-in/hr-ft²-°F	through-plane, ø80*3mm discs; ISO 22007-2
SABIC Innovative Plastics LNP KONDUIT OX11314 PPS (Asia Pacific) Thermally conductive mineral filled PPS FR compound
Thermal Conductivity	0.900 W/m-K	6.25 BTU-in/hr-ft²-°F	ASTM D5470
Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group RALUPOL® 802 UP Polyester Glass-fiber reinforced polyester molding compound. Low molding shrinkage and post-shrinkage, good electrical values, good mechanical strength, good heat resistance. This product meets the allowed up..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group RALUPOL® 804 UP Polyester Glass-fiber reinforced polyester molding compound. Low molding shrinkage and post-shrinkage, good electrical values, good mechanical strength. This product meets the allowed upper limits for heavy m..
Thermal Conductivity	0.900 - 1.10 W/m-K	6.25 - 7.63 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group SURAPLAST UPA 63 UP Glass fiber reinforced polyester molding compound. Minimal mold shrinkage and post-shrinkage, very good arc resistance, very good mechanical strength. This product meets the allowed upper limits for..
Thermal Conductivity	0.900 W/m-K	6.25 BTU-in/hr-ft²-°F
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, ..
Thermal Conductivity	0.900 W/m-K @Temperature 90.0 Â°C	6.25 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F
Schott Glass 8095 Lead Glass Lead glass (28% PbO), electrically highly insulating, highly x-ray absorbing General electrotechnical applicationInformation provided by SCHOTT AG.
Thermal Conductivity	0.900 W/m-K @Temperature 90.0 Â°C	6.25 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F
Schott Glass 8651 Sealing Glass Tungsten sealing glass Power diodesInformation provided by SCHOTT AG.
Thermal Conductivity	0.900 W/m-K @Temperature 90.0 Â°C	6.25 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F
Schott Glass 8652 Sealing Glass Tungsten sealing glass, lower sealing temperature than glass 8651 Power diodesInformation provided by SCHOTT AG.
Thermal Conductivity	0.900 W/m-K	6.25 BTU-in/hr-ft²-°F
Dow Corning SE 4422 SILICONE RTV One-part, grey, moisture cure RTV, flowable, thermally conductive, UL V-1.Information provided by Dow Corning
Thermal Conductivity	0.901 W/m-K	6.25 BTU-in/hr-ft²-°F	uncured
Atom Adhesives AA-DUCT 2979 Epoxy Adhesive AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours o..