Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.900 W/m-K @Pressure 2.07 MPa |
6.25 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL 1401 Conductive Elastomer High performance for non-corrosive environments; soft(45 Shore A) for low closure force where gasket geometry cannot be exploited; low tear strength; no fluid resistance. Molded and ExtrudedRoHS Com.. |
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Thermal Conductivity | 0.900 W/m-K @Pressure 2.07 MPa |
6.25 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL 6370 Conductive Elastomer Commercial Grade Conductive Elastomer Extrusions. These materials offer excellent cost/performance characteristics for commercial EMI gasket applications. These silicone and fluorosilicone based con.. |
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Thermal Conductivity | 0.900 W/m-K @Pressure 2.07 MPa |
6.25 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL® 6503 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric.. |
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Thermal Conductivity | 0.900 W/m-K | 6.25 BTU-in/hr-ft²-°F | ASTM D5470 |
Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 2568 AMC Glass fiber-reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, heat resistant up to 500°C for short time - usable for s.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 2572 AMC Glass fiber reinforced Polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, good abrasion stability, high flame retardance in combin.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 5563 DAP Glass-fiber reinforced diallyl phthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensiona.. |
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Thermal Conductivity | 0.900 - 1.00 W/m-K | 6.25 - 6.94 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RALUPOL® 2100 UP Polyester Organically and inorganically filled polyester molding compound. Low post-shrinkage, very good electrical values, good mechanical strength. This product meets the allowed upper limits for heavy meta.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | DIN 52 612 |
Raschig Group RALUPOL® 4385 UP Glass-fiber reinforced polyester molding compound. Low mold shrinkage and post-shrinkage, very high arc resistance, very high mechanical values. This product meets the allowed upper limits for heavy.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | DIN 52 612 |
Raschig Group RALUPOL® 4806 UP Glass-fiber reinforced polyester molding compound. Very low mold shrinkage and post-shrinkage, very good mechanical strength, very good electrical values, better performance values compared to UP 80.. |
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Thermal Conductivity | 0.900 W/m-K | 6.25 BTU-in/hr-ft²-°F | through-plane, ø80*3mm discs; ISO 22007-2 |
SABIC Innovative Plastics LNP KONDUIT OX11314 PPS (Asia Pacific) Thermally conductive mineral filled PPS FR compound |
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Thermal Conductivity | 0.900 W/m-K | 6.25 BTU-in/hr-ft²-°F | ASTM D5470 |
Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RALUPOL® 802 UP Polyester Glass-fiber reinforced polyester molding compound. Low molding shrinkage and post-shrinkage, good electrical values, good mechanical strength, good heat resistance. This product meets the allowed up.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group RALUPOL® 804 UP Polyester Glass-fiber reinforced polyester molding compound. Low molding shrinkage and post-shrinkage, good electrical values, good mechanical strength. This product meets the allowed upper limits for heavy m.. |
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Thermal Conductivity | 0.900 - 1.10 W/m-K | 6.25 - 7.63 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group SURAPLAST UPA 63 UP Glass fiber reinforced polyester molding compound. Minimal mold shrinkage and post-shrinkage, very good arc resistance, very good mechanical strength. This product meets the allowed upper limits for.. |
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Thermal Conductivity | 0.900 W/m-K | 6.25 BTU-in/hr-ft²-°F | |
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, .. |
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Thermal Conductivity | 0.900 W/m-K @Temperature 90.0 °C |
6.25 BTU-in/hr-ft²-°F @Temperature 194 °F |
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Schott Glass 8095 Lead Glass Lead glass (28% PbO), electrically highly insulating, highly x-ray absorbing General electrotechnical applicationInformation provided by SCHOTT AG. |
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Thermal Conductivity | 0.900 W/m-K @Temperature 90.0 °C |
6.25 BTU-in/hr-ft²-°F @Temperature 194 °F |
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Schott Glass 8651 Sealing Glass Tungsten sealing glass Power diodesInformation provided by SCHOTT AG. |
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Thermal Conductivity | 0.900 W/m-K @Temperature 90.0 °C |
6.25 BTU-in/hr-ft²-°F @Temperature 194 °F |
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Schott Glass 8652 Sealing Glass Tungsten sealing glass, lower sealing temperature than glass 8651 Power diodesInformation provided by SCHOTT AG. |
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Thermal Conductivity | 0.900 W/m-K | 6.25 BTU-in/hr-ft²-°F | |
Dow Corning SE 4422 SILICONE RTV One-part, grey, moisture cure RTV, flowable, thermally conductive, UL V-1.Information provided by Dow Corning |
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Thermal Conductivity | 0.901 W/m-K | 6.25 BTU-in/hr-ft²-°F | uncured |
Atom Adhesives AA-DUCT 2979 Epoxy Adhesive AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours o.. |