Thermal Properties | Metric | English | Comments |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | X; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® NX9294 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | X; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® NY9208 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | X; IPC-TM-650.2.4.41 |
Park Electrochemical Nelco® NY9217 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 100 °C |
13.9 µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP Ketron® CA30 PEEK + carbon fibres, extruded (ISO Data) This 30 % carbon fibre reinforced grade combines even higher stiffness, mechanical strength and creep resistance than Ketron PEEK-GF30 with an optimum wear resistance. Moreover, compared with unrein.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 100 °C |
13.9 µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP Duratron® PBI CU60 compression moulded (ISO Data) Duratron CU60 PBI is very “clean” in terms of ionic impurity and does not outgas (except water). These characteristics make this material extremely attractive to high-tech industries such as semic.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50/CF/10/GF/10/TF/10/BK Polycarbonate, with carbon fiber, glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50-1375 Polycarbonate, with carbon fiber, glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
DIN 53752; ASTM D696 |
Kolon KOPET® KP133G45 FR-PET Resin KOPET® is the FR-PET which realizes the good properties and surface of injection molding with good mold process of short cooling time in low molding temperature.Good mold release, good surface of.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 106 (Sn63) Sn-Pb Solder Alloy Standard eutectic tin-lead solder with wide application. Not recommended against silver and/or gold.Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1/GF/30/TF/15/SI/2-2 Polyamide 66, with glass fiber, PTFE, lubricant modified, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.High dimensionally stable prec.. |
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CTE, linear | 25.0 - 43.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.9 - 23.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL NF1030 PPE+PS (Asia Pacific) |
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CTE, linear | 25.0 - 30.0 µm/m-°C | 13.9 - 16.7 µin/in-°F | |
Master Bond EP45HTQ Quartz Filled Heat Resistant Epoxy Description: Master Bond Polymer Compound EP45HTQ is a two component quartz filled, epoxy compound for high performance structural bonding and casting. It is suitable for applications where long ter.. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | ISO 11359-2 |
Unitika E-RUNG60 PA66, 60% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd. |
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CTE, linear | 25.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
D696 |
Zhejiang Juner 301-G30 30% Glass Fibre Reinforced and Flammable Resistant Applications: Electrons and Electricity: TV Components, Plugs of Computers, Exhaust Fans of Computers, Plugs, Sockets, Shells of Electronics, Framework of Level Output Transformers, Pipe Pedestals, .. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
Alpha 1 |
Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
13.9 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6600 GVS 20/10 HWCP 20% Glass Fiber and 10% Glass Sphere Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 260 °C |
13.9 µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
Daelim H&L Plavis-G40 CM 40% Graphite Filled Aromatic Polyimide Bearing Compression Molded. Plavis-G-40: Graphite 40 wt% filled, Self lubricating grade with low thermal expansion.General Plavis information for all grades:PLAVIS polyimide has nitrogen bonded to 3 carbo.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 260 °C |
13.9 µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
Daelim H&L Plavis-G40 ISO 40% Graphite Filled Aromatic Polyimide Bearing Isostatically Molded. Plavis-G-40: Graphite 40 wt% filled, Self lubricating grade with low thermal expansion.General Plavis information for all grades:PLAVIS polyimide has nitrogen bonded to 3 car.. |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Devcon Carbide Putty Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives. |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | |
Epoxyset Epoxibond EB-315 Low Expansion Epoxy Adhesive EB-315 is a highly filled, heat curing, high temperature resistant epoxy adhesive. Due to its low coefficient of thermal expansion and outgassing, it can be used for bonding and sealing in critical .. |
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CTE, linear | 25.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 551GT20S PBT Resin Glass fiber and mineral filled, flame retardant, low warpage, superior electrical performance, surface glossInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
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AIM 54Sn/26Pb/20In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 25.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
13.9 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000 CF 30 HWCP 30% Carbon Fiber Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 25.0 µm/m-°C | 13.9 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1-7003 Polyamide 66, with carbon fiber and PTFE, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Electrically conductive, suita.. |
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CTE, linear | 25.0 - 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.9 - 30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL APS130 PPE+PPS (Asia Pacific) |