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Polymer Property : CTE, linear = 13.9 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
ISO 11359-1/-2
Polyplastic Armamid® PA GF50-1 Nylon 6, 50% Glass Fiber
High stiffnessInformation provided by PolyPlastic Group.
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
X; IPC-TM-650.2.4.41
Park Electrochemical Nelco® NX9294 PTFE Laminate, Woven-Glass Reinforced
The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat..
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
X; IPC-TM-650.2.4.41
Park Electrochemical Nelco® NX9320 PTFE Laminate, Woven-Glass Reinforced
The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat..
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
X; IPC-TM-650.2.4.41
Park Electrochemical Nelco® NY9208 PTFE Laminate, Woven-Glass Reinforced
The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat..
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
X; IPC-TM-650.2.4.41
Park Electrochemical Nelco® NY9220 PTFE Laminate, Woven-Glass Reinforced
The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat..
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50/CF/10/GF/10/TF/10/BK Polycarbonate, with carbon fiber, glass fiber and PTFE
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50/CF/7/GF/20/TF/10/BK Polycarbonate, with carbon fiber, glass fiber and PTFE
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
DIN 53752; ASTM D696
Kolon KOPET® KP133G45 FR-PET Resin
KOPET® is the FR-PET which realizes the good properties and surface of injection molding with good mold process of short cooling time in low molding temperature.Good mold release, good surface of..
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 117 Bi-Pb-In-Sn-Cd Fusible Alloy
General purpose fusible alloy.Information provided by the manufacturer, Indium Corporation.
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1/GF/30/TF/15/HS-B Polyamide 66, with glass fiber and PTFE, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.Heat stabilised.High dimension..
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1/GF/30/TF/15/SI/2-2 Polyamide 66, with glass fiber, PTFE, lubricant modified, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.High dimensionally stable prec..
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy 109 Tin-Lead Solder Alloy
Good electrical grade solderInformation Provided by Indium Corporation
CTE, linear 25.0 - 35.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.9 - 19.4 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics NORYL HFM3015P PPE+PS (Asia Pacific)
30% GF/MF filled FR PPE/PS blend
CTE, linear 25.0 µm/m-°C

@Temperature 23.0 - 85.0 °C
13.9 µin/in-°F

@Temperature 73.4 - 185 °F
ASTM E831
Solvay Technyl® A 216 V30 Nylon 66, 30% Glass Fiber, EH0
Polyamide PA66, reinforced with 30% of glass fiber, for injection molding.Technyl A 216 V30 is used in all sectors of industry, offering an excellent combination between thermal and mechanical prope..
CTE, linear 25.0 - 30.0 µm/m-°C
13.9 - 16.7 µin/in-°F
Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy
Master Bond EP112FLAO-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, fine thermal conductivity and electrical insulation values with ..
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
Alpha 1
Cosmic Plastics E4940 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade
Data provided by the manufacturer.
CTE, linear 25.0 µm/m-°C
13.9 µin/in-°F
ISO 11359-2
Unitika E-RUNG60 PA66, 60% Glass Fiber Reinforced, Conditioned
Information provided by Unitika Ltd.
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Toyobo VYLOPET® EMC130-20 Injection Molding Polyester Resin, Flame Resistant
Applications: Relay partsFeatures: Excellent arc resistanceFlame resistanceInformation provided by Toyobo.
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
Alpha 1
Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade
Data provided by the manufacturer.
CTE, linear 25.0 µm/m-°C

@Temperature 23.0 - 80.0 °C
13.9 µin/in-°F

@Temperature 73.4 - 176 °F
DIN 53752
CP-Polymer-Technik Wellamid® 6600 GVS 20/10 HWCP 20% Glass Fiber and 10% Glass Sphere Nylon 66, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear 25.0 µm/m-°C

@Temperature 23.0 - 260 °C
13.9 µin/in-°F

@Temperature 73.4 - 500 °F
ASTM D696
Daelim H&L Plavis-G40 CM 40% Graphite Filled Aromatic Polyimide Bearing
Compression Molded. Plavis-G-40: Graphite 40 wt% filled, Self lubricating grade with low thermal expansion.General Plavis information for all grades:PLAVIS polyimide has nitrogen bonded to 3 carbo..
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Devcon Tile Adhesive Epoxy
Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives.
CTE, linear 25.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.9 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM D696
Beijing Chemical Industry KAIFA® 551GT20S PBT Resin
Glass fiber and mineral filled, flame retardant, low warpage, superior electrical performance, surface glossInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
AIM 63Sn/Pb37 Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
CTE, linear 25.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
13.9 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM D696
Beijing Chemical Industry KAIFA® 201-G30 PBT Resin
30% glass fiber reinforcedInformation provided by Beijing Chemical Industry Research Institute (Group)
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