Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 97.0 µm/m-°C | 53.9 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
|||
CTE, linear | 97.0 µm/m-°C | 53.9 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
|||
CTE, linear | 97.0 µm/m-°C | 53.9 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
|||
CTE, linear | 97.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
53.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Ultramid® 8272G HS BK-102 12% Glass Filled PA6 (Dry) Ultramid 8272G HS BK-102 is a 12% glass fiber reinforced, black pigmented, thermally modified, nylon 6 blow molding compound offering an excellent balance of engineering properties combined with the.. |
|||
CTE, linear | 97.0 µm/m-°C @Temperature 20.0 °C |
53.9 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
LG Chemical HG-174 ABS, High Gloss, Super High Flow Information Provided by LG Chem |