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Polymer Property : CTE, linear = 69.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 69.0 µm/m-°C @Temperature 20.0 °C |
38.3 µin/in-°F @Temperature 68.0 °F |
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| Parylene Coating Services N Poly (P-Xylylene) Monomer is para-xylylene. Parylene N has a lower coefficient of friction and therefore is recommended where lubricity is needed. Parylene N exhibits a slight haze at thicknesses over 5 microns.Par.. |
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| CTE, linear | 69.0 µm/m-°C @Temperature 20.0 °C |
38.3 µin/in-°F @Temperature 68.0 °F |
|
| Kleerdex Kydex® L Acrylic/PVC Thermoplastic Sheet
(discontinued **) Laminating grade fire rated sheetApplications: Store fixtures and displays, exhibits, service counters, doors, partitionsFeatures: Toughness and durability, solid, integral color, chemical resistanc.. |
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| CTE, linear | 69.0 µm/m-°C @Temperature 20.0 °C |
38.3 µin/in-°F @Temperature 68.0 °F |
|
| Resin Technology Group UV CC-2004 Multi-Functional, UV Curing, Conformal-Coating Multi-functional UV-CC 2004 is a single component, solvent-less conformal-coating specifically formulated for rapid room temperature cure when exposed to UV light. Thin layer coatings cure almost in.. |
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| CTE, linear | 69.0 µm/m-°C | 38.3 µin/in-°F | Alpha 2; TMA |
| Lord Adhesives Thermosetâ„¢ ME-455-1 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavi.. |
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| CTE, linear | 69.0 µm/m-°C | 38.3 µin/in-°F | via TMA |
| Specialty Coating Systems Parylene N Poly (P-Xylylene) Coating Parylene N, poly(para-xylylene), is a completely linear, highly crystalline material. Parylene N is a primary dielectric, exhibiting a very low dissipation factor, high dielectric strength, and a lo.. |
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| CTE, linear | 69.0 µm/m-°C @Temperature 40.0 - 130 °C |
38.3 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 2308 Phenolic, Granular, Transfer Molded PLENCO 02308 is a general purpose organic filled phenolic molding compound, offering improved heat resistance and optimized cure properties. UL recognized under component file E40654. 02308 is avai.. |
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| CTE, linear | 69.0 µm/m-°C @Temperature 20.0 °C |
38.3 µin/in-°F @Temperature 68.0 °F |
|
| Loctite® Output™ 315 Acrylic Adhesive Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or.. |
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| CTE, linear | 69.0 µm/m-°C | 38.3 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® CF6-2 High Temperature Epoxy Product Description: EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging. Advantages & Application Notes: The low viscosity nature allows for wi.. |
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| CTE, linear | 69.0 µm/m-°C | 38.3 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OG603 UV Cure Optical Epoxy Material Description: A single component, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic co.. |
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| CTE, linear | 69.0 µm/m-°C @Temperature 20.0 °C |
38.3 µin/in-°F @Temperature 68.0 °F |
|
| Armstrong A-5/E Epoxy Adhesive Information provided by Ellsworth Adhesives. |
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