Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 67.0 µm/m-°C @Temperature 23.0 - 55.0 °C |
37.2 µin/in-°F @Temperature 73.4 - 131 °F |
ISO 11359-2:1999 |
Global EPP PET SL PET + Solid Lubricant PET is an unreinforced, semi-crystalline thermoplastic polyester, demonstrating dimensional stability similar to acetal, combined with the comparable wear resistance of nylon. Heavily loaded mechani.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 20.0 °C |
37.2 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ AE4200N Modified Nylon 6T, for Tribolic Applications, Flame Retardant (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 20.0 °C |
37.2 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ AE4200N Modified Nylon 6T, for Tribolic Applications, Flame Retardant (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 20.0 °C |
37.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Styron EMERGEâ„¢ 7500 Polycarbonate (PC) / Acrylonitrile Butadiene Styrene (ABS) EMERGEâ„¢ PC/ABS 7500 advanced resin is an ignition-resistant PC/ABS blend that contains no chlorine or bromine additives. This resin is suitable for use in a wide variety of applications in the.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 40.0 - 130 °C |
37.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 1581 Polyester, Pellet, Injection Molded PLENCO 01581 is a glass and mineral reinforced pelletized polyester molding compound, exhibiting excellent dimensional stability, mechanical strength and also arc resistance, track resistance, and f.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 40.0 - 130 °C |
37.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 2311 Phenolic, Granular, Compression Molded PLENCO 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. PLENCO 02311 is also granulated to provide impr.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 40.0 - 130 °C |
37.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 2369 Phenolic, Granular, Transfer Molded PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369.. |
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CTE, linear | 67.0 µm/m-°C | 37.2 µin/in-°F | Below Tg |
Tra-Con Tra-Bond 931-1 Low Viscosity Encapsulant TRA-BOND 931-1 low viscosity epoxy encapsulant is designed for high reliability applications, where capillary action is desired. This encapsulant provides environmental and mechanical protection.Inf.. |
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CTE, linear | 67.0 µm/m-°C | 37.2 µin/in-°F | |
Hexcel® HexPly® 171/174/176 120°C Curing Epoxy Matrix The HexPly® 174 family is a range of flexible 120°C curing matrix systems for a wide variety of industrial applications and is ideally matched to the following processes: shrink wrap tape, vacuum .. |
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CTE, linear | 67.0 µm/m-°C @Temperature 20.0 °C |
37.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Covestro Makrolon® T 7435 Polycarbonate, High Impact Impact modified injection molding grade, extremely easy flow and easy mold release, housings for portable mobile phones.Information provided by Bayer.As of 1 September 2015, Bayer MaterialScience wa.. |
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CTE, linear | 67.0 µm/m-°C | 37.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 310M-2 Optically Clear, Flexible Epoxy Material Description: A two component, optically clear, flexible epoxy adhesive designed for optical applications within semiconductor, fiber optic and medical industries. An alternative to EPO-TEK.. |
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CTE, linear | 67.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
37.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 301-G15RF PBT Resin 15% glass fiber reinforced, flame retardant, good toughness, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 67.0 µm/m-°C | 37.2 µin/in-°F | Below Tg |
Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use.. |
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CTE, linear | 67.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
37.2 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
Borealis Daplen™ EE103AE TPO Compound Daplen EE103AE is a 10% mineral and elastomer modified polypropylene compound intended for injection molding. Daplen EE103AE is a material with excellent impact /stiffness ratio. Thanks to its low .. |
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CTE, linear | 67.0 µm/m-°C @Temperature 40.0 - 130 °C |
37.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 7321 Phenolic, Nodular, Compression Molded PLENCO 07321 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength and excellent dimensional stability. Type ASTM 5948 CFI-5, and UL recognized under compon.. |
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CTE, linear | 67.0 µm/m-°C @Temperature 20.0 °C |
37.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Aclo Accutech TPO TPO030T9V Paintable Grade Approved to Suzuki Spec Black B14257 |