Polymer Property : CTE, linear = 44.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	44.0 µm/m-°C	24.4 µin/in-°F
Resinlab® EP1121-4 Adhesive / Casting Resin Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives ..
CTE, linear	44.0 µm/m-°C	24.4 µin/in-°F	X-Direction; IPC-TM-650 2.4.41
Rogers Corporation RT/duroid® 5880LZ Lightweight, High Frequency PTFE Laminate RT/duroid® 5880LZ filled PTFE composites are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performa..
CTE, linear	44.0 - 67.0 µm/m-°C @Temperature 40.0 - 130 °C	24.4 - 37.2 µin/in-°F @Temperature 104 - 266 °F	Average value: 54.0 µm/m-°C Grade Count:3
Overview of materials for Phenolic, Novolac, Flock Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Flock Filled". Each property range of values reported is minimum and maximum values o..
CTE, linear	44.0 µm/m-°C	24.4 µin/in-°F	Below Tg
Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devi..
CTE, linear	44.0 µm/m-°C @Temperature 40.0 - 130 °C	24.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4301 Phenolic, Granular, Injection Molded PLENCO 04301 is a heat resistant, mineral filled phenolic molding compound offering excellent dimensional stability and electrical properties. UL recognized under component file E40654. 04301 is ava..
CTE, linear	44.0 µm/m-°C @Temperature 40.0 - 130 °C	24.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 7476 Phenolic, Granular, Transfer Molded PLENCO 07476 is a cotton flock filled resole phenolic molding compound, with improved physical strength, crack resistance, and is resistant to soap and detergent solutions at elevated temperatures. ..
CTE, linear	44.0 µm/m-°C	24.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
CTE, linear	44.0 µm/m-°C @Temperature -60.0 - 80.0 °C	24.4 µin/in-°F @Temperature -76.0 - 176 °F
3M Scotch-Weld™ 2214 Hi-Temp New Formula Epoxy Adhesive 3M™ Scotch-Weld™ Adhesive 2214 Hi-Temp Formula is an aluminum filled, deaerated products fro use where higher strengths are required between 82-177°C. One part 250°F (121°C) curing 100% solids,..