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Polymer Property : CTE, linear = 4.50 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive  (discontinued **)
Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C).
CTE, linear 4.50 - 280 µm/m-°C
2.50 - 156 µin/in-°F
Average value: 78.7 µm/m-°C Grade Count:69
Overview of materials for Epoxy, Electrically Conductive
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Electrically Conductive". Each property range of values reported is minimum and maximum values of..
CTE, linear 4.50 µm/m-°C

@Temperature 25.0 - 260 °C
2.50 µin/in-°F

@Temperature 77.0 - 500 °F
Ferro EG 2738 Dental Glass
Glass Type: Ba-Al-B-Si Typical Application: Glass Filler Ferro's Dental Glasses are standard x-ray opaque glass powders and inorganic fillers for use in dental restorations. Ferro also manufacture..
CTE, linear 4.50 µm/m-°C

@Temperature 25.0 - 260 °C
2.50 µin/in-°F

@Temperature 77.0 - 500 °F
Ferro IP 820 Passivation Glasses (Pb-B-Si-Al; Pb-Si-Al; Si-Pb-Al Silicates)
Glass Type: Pb-Si-Al Typical Powder Form: TF, REG, RWG, SRRG Ferro's passivation glasses are designed for use on transistors, thyristors, and diodes. These products are formulated and produced to a..
CTE, linear 4.50 µm/m-°C

@Temperature 260 °C
2.50 µin/in-°F

@Temperature 500 °F
Ferro IX 2443 Passivation Glasses - High Voltage (Zn-B-Silicates)
Typical Powder Form: RWG, DSD Zinc-Boro-Silicate passivation glasses are used for hermetic passivation of high voltage diodes, thyristors, and transistors. They provide high junction temperatures a..
CTE, linear 4.50 µm/m-°C

@Temperature 260 °C
2.50 µin/in-°F

@Temperature 500 °F
Ferro IX 2683 Passivation Glasses - High Voltage (Zn-B-Silicates)
Typical Powder Form: DSD Zinc-Boro-Silicate passivation glasses are used for hermetic passivation of high voltage diodes, thyristors, and transistors. They provide high junction temperatures and ca..
CTE, linear <= 4.50 µm/m-°C

@Temperature 20.0 °C
<= 2.50 µin/in-°F

@Temperature 68.0 °F
MarkeTech AN 90 Aluminum Nitride Ceramic Substrate, 98% Purity
Data provided by the supplier, MarkeTech International.Substrate Specs: Maximum dimensions 5.5 x 3.6 in.. Thickness 0.12-0.60 in. Surface roughness 0.3 µm as fired; 0.075 µm lapped; 0.025 Â..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
MarkeTech Neodymium Gallium Oxide (NdGaO3) Single Crystal Substrate
Data provided by the supplier, MarkeTech International.Developed for deposition of III-V nitrides for LEDs, Lasers, etc. Standard orientation: ; GaN Lattice Mismatch 1.2%.
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 400 °C
2.50 µin/in-°F

@Temperature 68.0 - 752 °F
Mi-Tech Metals Diemitechâ„¢ Tungsten-Based Metal
Diemitech is a new tungsten-based material used for high temperature tooling, die casting, extrusion dies, hot upsetting, and electro brazing. It has a higher tungsten content than similar available..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 400 °C
2.50 µin/in-°F

@Temperature 68.0 - 752 °F
Mi-Tech Metals HD18.5 Tungsten-Based Metal
Mil Spec T-21014D Class 4; ASTM B-777-99 Class 4; ASTM B-777-07 Class 4; AMS T-21014 Class 4. Slightly Magnetic.Manufactured by powder metallurgy methods. The tungsten base offers high thermal con..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 400 °C
2.50 µin/in-°F

@Temperature 68.0 - 752 °F
Mi-Tech Metals Super Chatter Freeâ„¢ HD17.7 Tungsten-Based Metal
Slightly Magnetic.Manufactured by powder metallurgy methods. The tungsten base offers high thermal conductivity and a low CTE which combine to resist thermal fatigue. The high melting point reduce..
CTE, linear 4.50 µm/m-°C

@Temperature 25.0 - 260 °C
2.50 µin/in-°F

@Temperature 77.0 - 500 °F
Ferro IP 770 Passivation Glasses (Pb-B-Si-Al; Pb-Si-Al; Si-Pb-Al Silicates)
Glass Type: Pb-Si-Al Typical Powder Form: TF, REG, RWG, SRRG Ferro's passivation glasses are designed for use on transistors, thyristors, and diodes. These products are formulated and produced to a..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 300 °C
2.50 µin/in-°F

@Temperature 68.0 - 572 °F
Schott AF 45 Thin Borosilicate Glass
AF 45 is an alkali-free modified borosilicate glass with a high content of BaO and Al2O3. AF 45 with, its specific properties and large range of different thicknesses with tight tolerances, is exc..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 300 °C
2.50 µin/in-°F

@Temperature 68.0 - 572 °F
ISO 7991
Schott Glass 8449 Intermediate Sealing Glass
Intermediate sealing glass Sealing to the glasses 8412, 8447, and 8487Information provided by SCHOTT AG.
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 300 °C
2.50 µin/in-°F

@Temperature 68.0 - 572 °F
ISO 7991
Schott NEO 1730 Alkaline Earth Aluminosilicate Glass
Alkaline earth aluminosilicate glass for high temperature applications in electrical engineering, for sealing to molybdenum, free from alkali Bulb and exhaust tube for halogen lamps for automotive,..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
SGL Carbon Group EK 2201 Carbon Graphite
Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
Specialty Materials 5505 Boron Epoxy Prepreg Tape
Specialty Materials' 5505 is a highly advanced prepreg tape, combining Specialty Materials' 4.0 or 5.6 mil boron filament with a tough, rigid, epoxy resin. Exhibiting exceptional performance at temp..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
Specialty Materials 5521 Boron Epoxy Prepreg Tape
Specialty Materials' 5521 is a highly advanced prepreg tape, combining Specialty Materials' 4.0 or 5.6 mil boron filament with a tough, rigid, epoxy resin. Performing at temperatures up to 350°F,..
CTE, linear 4.50 µm/m-°C

@Temperature 22.8 - 260 °C
2.50 µin/in-°F

@Temperature 73.0 - 500 °F
ASTM E831
Saint-Gobain Meldin® 7021 Direct Formed Graphite Filled Polyimide
Finished parts and basic shapes made from 15% by weight graphite filled polyimide material for applications high wear resistance, good thermal oxidative stability, and high temperature resistance. ..
CTE, linear 4.50 µm/m-°C

@Temperature 23.0 - 85.0 °C
2.50 µin/in-°F

@Temperature 73.4 - 185 °F
ASTM D696
Solvay TECHNYL® 2412GHF6 PA66, 33% glass fiber, DRY
Description: Polyamid 66, reinforced with 33% of glass fiber, heat stabilized for injection moldingAvailable in: Asia PacificProduct Applications: TECHNYL® 2412GHF6 is used in all sectors of indu..
CTE, linear 4.50 µm/m-°C

@Temperature 1000 °C
2.50 µin/in-°F

@Temperature 1830 °F
UBE Tyranno Grade SA Ceramic High Temperature Fiber
Description: Tyranno Fiber is the continuous ceramic fiber consisting of Si, Ti or Zr,C and O. Advanced composites reinforced by the Tyranno Fiber are expected to play a very important role in the e..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
across thickness
Ultracor® UCF-51-3/8-2.0 Honeycomb Core Material
Construction: ±45° XN50. Fiber: Carbon XN50. Ultracor® is a very low density honeycomb core material designed for use in highly weight-sensitive structures.  It is expected that it will be use..
CTE, linear 4.50 µm/m-°C

@Temperature 25.0 - 1000 °C
2.50 µin/in-°F

@Temperature 77.0 - 1830 °F
ASTM-C372
CoorsTek Boron Carbide Reaction-Bonded Boron Carbide
Lowest density for ultra-lightweight designs
CTE, linear 4.50 µm/m-°C

@Temperature 1000 °C
2.50 µin/in-°F

@Temperature 1830 °F
Chosun Refractories HL-15 Special Insulating Firebrick
Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
CTE, linear 4.50 µm/m-°C

@Temperature 1000 °C
2.50 µin/in-°F

@Temperature 1830 °F
Chosun Refractories SB85S Bricks, Oxide Bonded SiC
Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
CTE, linear 4.50 µm/m-°C

@Temperature 1000 °C
2.50 µin/in-°F

@Temperature 1830 °F
Chosun Refractories SB90S Bricks, Oxide Bonded SiC
Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
CTE, linear 4.50 - 5.20 µm/m-°C

@Temperature 25.0 - 800 °C
2.50 - 2.89 µin/in-°F

@Temperature 77.0 - 1470 °F
China-Yixing Longly Refractories ZTA (20%ZrO2) Zirconia Toughened Alumina Composite Ceramic
LONGLY's Zirconia Toughened Alumina ceramics (hereafter referred as composite ceramic, ZTA) is white, corrosion resistance, good chemical stability. As well all know that alumina is hard, while zir..
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 - 1000 °C
2.50 µin/in-°F

@Temperature 68.0 - 1830 °F
Ceradyne CeraTrex™ SC-P2 Silicon Carbide
Features:purity>99.9995%corrosion resistancewear resistancenear net shape fabrication to 400 mm OD Applications:semiconductor componentswear componentsInformation provided by Ceradyne Company
CTE, linear 4.50 µm/m-°C

@Temperature 20.0 °C
2.50 µin/in-°F

@Temperature 68.0 °F
Aremco AREMCOLOX™ 502-1100 (Unfired) Machinable Alumino-Silicate
Good thermal and dielectric properties and can be fired to increase temperature resistance and mechanical strength. Easily machined to close tolerances. Plates, rods and bars available to 12".
CTE, linear 4.50 µm/m-°C

@Temperature 27.0 - 175 °C
2.50 µin/in-°F

@Temperature 80.6 - 347 °F
ASTM D696
3M 7993MP Hi-Performance Acrylic 200MP
This adhesive meets the requirements of most long-term applications. It offers temperature resistance to 400°F (204°C). Peel adhesion values are excellent on most membrane switch substrate materia..
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