Thermal Properties | Metric | English | Comments |
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Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
Park Electrochemical Nelco® N4000-13 EP™ BC® Buried Capacitance™, High-Speed Multifunctional Epoxy Laminate and Prepreg Nelco N4000-13 EP™ is an enhanced epoxy resin system engineered for today’s leadfree requirements where multiple solder reflow at temperatures approaching 260ºC are required. N4000-13 EP provides.. |
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Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
Park Electrochemical Nelco® N4000-13 High-Speed Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applic.. |
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Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
Park Electrochemical Nelco® N4380-13 RF Microwave Performance, Modified Epoxy The Nelco N4350-13 RF and N4380-13 RF series are enhanced epoxy resin systems specifically engineered to provide a unique solution for design applications that demand outstanding thermal properties,.. |
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Decomposition Temperature | 350 °C | 662 °F | 5% wt loss in N<sub>2</sub> |
Hybrid Plastics Polyamide POSS® Flow Masterbatch POSS® Flow masterbatches show success in reducing the melt viscosity of a variety of injection molded and extruded resins. Hybrid Plastics now introduces such a solution for polyamide polymers. P.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Solvay Chemicals Ixper® 35M Magnesium Peroxide IXPER® 35M is a Magnesium Peroxide powder used in a wide range of applications in environmental, and oil drilling e.g. markets. EINECS Number: 215-627-7/CAS Number: 1335-26-8Information provided .. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Solvay Chemicals Ixper® 75C Calcium Peroxide IXPER® 75C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking and oil drilling e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Info.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Shandong Dongyue Shenzhou New Material Co CHF085 Perfluorosulfonic Acid Ion-Exchange Resin (PFSA) Conformable with: Q/DYS 001-2007Perfluorosulfonic Acid Ion-Exchange Resin is a polymer, with good stability and chemical resistance properties, which are widely used in chlor-alkali industry, proton.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Shandong Dongyue Shenzhou New Material Co CHF100 Perfluorosulfonic Acid Ion-Exchange Resin (PFSA) Conformable with: Q/DYS 001-2007Perfluorosulfonic Acid Ion-Exchange Resin is a polymer, with good stability and chemical resistance properties, which are widely used in chlor-alkali industry, proton.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Shandong Dongyue Shenzhou New Material Co CHF105 Perfluorosulfonic Acid Ion-Exchange Resin (PFSA) Conformable with: Q/DYS 001-2007Perfluorosulfonic Acid Ion-Exchange Resin is a polymer, with good stability and chemical resistance properties, which are widely used in chlor-alkali industry, proton.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Shandong Dongyue Shenzhou New Material Co CHFM 050 Perfluorosulfonic Acid Proton Exchange Membrane (PFSAPEM) Conformable with: Q/DYS 013-2007Perfluorosulfonic Acid Proton Exchange Membrane is a special polymer, mainly used for the processing of fuel cell membrane and chlor-alkali ion exchange membrane. Th.. |
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Decomposition Temperature | 350 °C | 662 °F | ASTM E1131 |
Zeus EFEP Tubing |
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Decomposition Temperature | 350 °C | 662 °F | 1.7% weight loss per hour |
Dow CYCLOTENE™ 4024-40 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4024-40 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Decomposition Temperature | 350 °C | 662 °F | 1.7% weight loss per hour |
Dow CYCLOTENE™ 4026-46 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4026-46 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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Decomposition Temperature | 350 °C | 662 °F | Degradation Temperature |
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Basotect G+ Foam Basotect® is a flexible, open cell foam made from melamine resin, a thermoset polymer. Its characteristic feature is its three-dimensional network structure consisting of slender and thus easily sh.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4350 BK 00464 PA6/6T (Conditioned) Description: For injection-molding and extrusion, exhibiting high toughness, strength and stiffness, low water absorption, high melting point (295 °C [563°F]). The mechanical properties remain con.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4350 BK 00464 PA6/6T (Dry) Description: For injection-molding and extrusion, exhibiting high toughness, strength and stiffness, low water absorption, high melting point (295 °C [563°F]). The mechanical properties remain con.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4355 G10 BK 23215 50% Glass Filled PA6/6T (Dry) Description: 50% glass-fiber reinforced product for injection molding; high toughness and rigidity; low water absorption, high melting point (285°C); mechanical properties remain constant up to 60°.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4355 G5 25% Glass Filled PA6/6T (Dry) Description: 25% glass-fiber reinforced product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechanical properties r.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4355 G5 BK 00564 25% Glass Filled PA6/6T (Dry) Description: 25% glass-fiber reinforced product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechanical properties r.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4355 G7 BK 00564 35% Glass Filled PA6/6T (Dry) Description: 35% glass-fiber reinforced product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechanical properties r.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4357 G6 30% Glass Filled PA6/6T (Dry) Description: 30% glass-fiber reinforced, impact-modified product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechan.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4357 G6 BK 00564 30% Glass Filled PA6/6T (Conditioned) Description: 30% glass-fiber reinforced, impact-modified product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechan.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4357 G6 BK 00564 30% Glass Filled PA6/6T (Dry) Description: 30% glass-fiber reinforced, impact-modified product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechan.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Ultramid® KR 4365 G5 BK 00100 35% Glass Filled PA6/6T FR (Conditioned) Description: Partially aromatic polyamide; flame retardant based on red phosphorus; low water absorption, high melting point (295°C); low tendency to form deposits on electrical contacts, very resi.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Basotect W Foam Basotect® is a flexible, open cell foam made from melamine resin, a thermoset polymer. Its characteristic feature is its three-dimensional network structure consisting of slender and thus easily sh.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
BASF Basotect TG Foam Basotect® is a flexible, open cell foam made from melamine resin, a thermoset polymer. Its characteristic feature is its three-dimensional network structure consisting of slender and thus easily sh.. |
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Decomposition Temperature | >= 350 °C | >= 662 °F | |
Shandong Dongyue Shenzhou New Material Co CHFM 150 Perfluorosulfonic Acid Proton Exchange Membrane (PFSAPEM) Conformable with: Q/DYS 013-2007Perfluorosulfonic Acid Proton Exchange Membrane is a special polymer, mainly used for the processing of fuel cell membrane and chlor-alkali ion exchange membrane. Th.. |