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Dow CYCLOTENE™ 4026-46 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB)

Category Polymer
Manufacturer Dow Chemical
Trade Name CYCLOTENE™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Dow CYCLOTENE™ 4026-46 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB).pdf
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Material Notes:
CYCLOTENE™ 4026-46 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Information provided by Dow
Physical Properties Metric English Comments
Viscosity Measurement 1100
1100
[cSt]
Thickness 7.00 - 14.0 microns
0.276 - 0.551 mil
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 78.0 - 96.0 MPa
11300 - 13900 psi
Elongation at Break 5.5 - 10.5 %
5.5 - 10.5 %
Tensile Modulus 2.70 - 3.10 GPa
392 - 450 ksi
Poissons Ratio 0.34
0.34
Shear Modulus 1.01 - 1.16 GPa
146 - 168 ksi
Calculated
Thermal Properties Metric English Comments
CTE, linear 42.0 µm/m-°C

@Temperature 20.0 °C
23.3 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.290 W/m-K
2.01 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg >= 350 °C
>= 662 °F
Decomposition Temperature 350 °C
662 °F
1.7% weight loss per hour
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+19 ohm-cm
1.00e+19 ohm-cm
Dielectric Constant 2.65

@Frequency 1.00e+9 - 2.00e+10 Hz
2.65

@Frequency 1.00e+9 - 2.00e+10 Hz
Dielectric Strength 530 kV/mm
13500 kV/in
Dissipation Factor 0.00080
0.00080
Descriptive Properties Value Comments
Leakage Current A/cm² 0.00000000047
at 1.0 MV/cm<sup>2</sup>
Stress on Si MPa, Min 26 - 30
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