Polymer Property : CTE, linear = 43.9 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	79.0 µm/m-°C @Temperature 160 - 250 °C	43.9 µin/in-°F @Temperature 320 - 482 °F	FD; ASTM E831
Solvay Specialty Polymers Amodel® A-1240 HS Polyphthalamide (PPA) Resin, 40% Mineral Reinforced, Dry As Molded &nbs AMODEL A-1240 polyphthalamide (PPA) resins are 40% mineral filled resins that have high deflection temperature, flexural modulus, and tensile strength. They mold with low warpage, have excellent di..
CTE, linear	79.1 µm/m-°C @Temperature 50.0 - 100 °C	43.9 µin/in-°F @Temperature 122 - 212 °F	ASTM E831-12
DSM Somos® PerFORM Stereolithography Polymer, UV Postcure PerFORM produces strong, stiff, high-temperature resistant composite parts on standard 355 nm stereolithography machines. This material’s lower viscosity makes processing parts faster. It exhibits ..
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; JMTP P200
Aptek 2100-A7C/B Low modulus urethane staking compound APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Althoug..
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; JMTP P200
Aptek 2205 A/B Low modulus urethane stacking compound APTEK 2205-A/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although..
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications.Part A is hazy blue. Pa..