Category | Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive |
Manufacturer | Aptek Laboratories |
Trade Name | |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Aptek 2205 A/B Low modulus urethane stacking compound.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 0.990 g/cc | 0.0358 lb/in³ | A Component; ASTM D1475 |
1.21 g/cc | 0.0437 lb/in³ | B Component; ASTM D1475 | |
Viscosity | 88 cP | 88 cP | B Component; ASTM D1824 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore A | 65 | 65 | Cured property; ASTM D2240 |
Tensile Strength, Ultimate | 6.03 MPa | 875 psi | Cured property; ASTM D412 |
Elongation at Break | 265 % | 265 % | Cured property; ASTM D412 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 79.0 µm/m-°C @Temperature 20.0 °C |
43.9 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 1; JMTP P200 |
185 µm/m-°C @Temperature 20.0 °C |
103 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 2; JMTP P200 | |
Glass Transition Temp, Tg | -70.0 °C | -94.0 °F | Cured property; JMTP P-200 |
Flash Point | >= 125 °C | >= 257 °F | B Component; ASTM D92 |
>= 150 °C | >= 302 °F | A Component; ASTM D92 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.30e+15 ohm-cm | 1.30e+15 ohm-cm | Cured property; ASTM D257 |
Dielectric Constant | 3.5 @Frequency 1000 Hz |
3.5 @Frequency 1000 Hz |
Cured property; ASTM D150 |
Dissipation Factor | 0.030 @Frequency 1000 Hz |
0.030 @Frequency 1000 Hz |
Cured property; ASTM D150 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 85.0 °C | 185 °F | Cure 4 hrs |