Polymer Property : Glass Transition Temp, Tg = 86.0 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	30.0 °C	86.0 °F	DSC; ASTM E1356-03
NeXolve White Optionox® Polyimide Film Highly UV durable with excellent weatherability and stability to ozone.Optinox® films and coatings are highly UV durable and exhibit excellent weathering durability, including very high stability ..
Glass Transition Temp, Tg	30.0 - 220 °C	86.0 - 428 °F	Average value: 108 °C Grade Count:22
Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val..
Glass Transition Temp, Tg	30.0 Â°C	86.0 Â°F	ASTM E1356
SK Chemicals SKYTHANEÂ® UB601 Ink Binder Description: SK Chemicals has supplied Thermoplastic Polyurethane Elastomer (TPU) under the name of SKYTHANE. UB series are used for adhesives and coating applications such as binder for magnetic ta..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond FLM36 B-staged film for high performance bonding and sealing Master Bond FLM36 is a film adhesive with exceptional strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master ..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond X17MED Elastomer Compound for Medical Device Applications Description: Master Bond Polymer System X17MED is a specially formulated one component adhesive specially designed for bonding polyolefins such as polypropylene and polyethylene as well as their man..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Loctite® Durabond® E-40FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® RS LC2800 NC010 Nylon (Unverified Data**) Plasticized Renewably Sourced Polyamide Developed for Extrusion Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg	30.0 °C	86.0 °F	Ultimate Tg
Tra-Con Tra-Bond FS411 Fast Cure Epoxy Adhesive System TRA-BOND FS-411 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. It was designed to have low outgassing in ..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	TM R050-25
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
DuPont Performance Polymers Hypalon® CP-826 Adhesion Primer, General Description (discontinued **) Hypalon CP 826 is a chlorinated, maleic anhydride grafted polypropylene resin.Suggested End Uses: Adhesion primer for:PolypropylenePolypropylene blends with TPOs (auto bumpers)Polyurethane foam, (at..