Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 260 °C | 500 °F | DSC; IPC-TM-650.2.4.25c |
Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for.. |
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Glass Transition Temp, Tg | 260 °C | 500 °F | DSC; IPC-TM-650.2.4.25c |
Park Electrochemical Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg The Nelco N7000-2 HT laminate and N7000-3 prepreg are a series of toughened polyimide materials for use in high-reliability multilayers. This combined resin system provides excellent thermal perform.. |
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Glass Transition Temp, Tg | 260 °C | 500 °F | DSC |
Ensinger TECASINT 4011 Polyimide, Yellow (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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Glass Transition Temp, Tg | 260 °C | 500 °F | DMTA |
Ensinger TECASINT 4021 Polyimide, Black, 15% Graphite (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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Glass Transition Temp, Tg | 260 °C | 500 °F | DMTA |
Ensinger TECASINT 4041 Polyimide, Glossy Black, Molybdenum Sulfide (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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Glass Transition Temp, Tg | 260 - 370 °C | 500 - 698 °F | Average value: 347 °C Grade Count:10 |
Overview of materials for Polyimide, Graphite Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Graphite Filled". Each property range of values reported is minimum and maximum values of app.. |