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Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg.pdf
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Material Notes:
The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for applications requiring the superior thermal stability and chemical resistance provided by a polyimide.Key Features and Benefits:Polyimide resin chemistryLead-free assembly compatibilitySupports current and previous military and industrial standardsReliable plated-through holesProven processing and performanceApplications/Qualifications:Fine-Line MultilayersBackplanesSurface-Mount MultilayersBGA MultilayersMCM-LsDirect Chip AttachHigh Speed ComputingBurn-in BoardsInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Density 1.68 g/cc
0.0607 lb/in³
50% Resin Content; Internal Method
Water Absorption 0.35 %
0.35 %
IPC-TM-650.2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 26.9 GPa
3900 ksi
X; ASTM D3039
26.9 GPa
3900 ksi
Y; ASTM D3039
Poissons Ratio 0.12
0.12
X; ASTM D3039
0.12
0.12
Y; ASTM D3039
Peel Strength 1.05 kN/m
6.00 pli
at elevated temperature; IPC-TM-650.2.4.8.2a
1.23 kN/m
7.00 pli
after exposure to process solutions; IPC-TM-650.2.4.8
1.31 kN/m
7.50 pli
after solder float; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 12.0 - 15.0 µm/m-°C

@Temperature -40.0 - 125 °C
6.67 - 8.33 µin/in-°F

@Temperature -40.0 - 257 °F
IPC-TM-650.2.4.41
Glass Transition Temp, Tg 250 °C
482 °F
TMA; IPC-TM-650.2.4.24c
260 °C
500 °F
DSC; IPC-TM-650.2.4.25c
Decomposition Temperature 389 °C
732 °F
5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm-cm
1.00e+13 ohm-cm
E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohm
1.00e+13 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm
1.00e+13 ohm
E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.8

@Frequency 1.00e+10 Hz
3.8

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
3.9

@Frequency 1.00e+10 Hz
3.9

@Frequency 1.00e+10 Hz
Split Post Cavity
3.9

@Frequency 1.00e+9 Hz
3.9

@Frequency 1.00e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
3.9

@Frequency 2.50e+9 Hz
3.9

@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
Dielectric Strength 53.1 kV/mm
1350 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.0095

@Frequency 1.00e+10 Hz
0.0095

@Frequency 1.00e+10 Hz
Split Post Cavity
0.015

@Frequency 2.50e+9 Hz
0.015

@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
0.016

@Frequency 1.00e+10 Hz
0.016

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 136 sec
136 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Methylene Chloride Resistance (% Weight Change) 0.42
IPC-TM-650.2.3.4.3
Pressure Cooker Pass
60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) 12+
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) 1.8
50ºC to 260ºC; IPC-TM-650.2.4.41
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