Polymer Property : Flexural Modulus = 12.4 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Solvay Specialty Polymers Amodel® AF-4133 V0 Polyphthalamide (PPA) Resin, 33% Glass Reinforced (discontinued AMODEL AF-4133 V0 is a 33% glass reinforced grade of polyphthalamide (PPA) resin that was designed specifically to process with water-cooled molds and meet the requirements of most electrical/electr..
Flexural Modulus	12.4 GPa	1800 ksi	Tangent; ASTM D790-1
Premix Premi-Glas® 8102-13 Glass Reinforced Polyester BMC (discontinued **) Description: Premi-Glas® 8102-13 is a glass reinforced thermoset polyester Bulk Molding Compound designed for injection molding of automotive forward lighting reflectors. Key features and benefits:..
Flexural Modulus	12.4 GPa	1800 ksi	Tangent; ASTM D790-1
Premix Premi-Glas® 8102-20 Glass Reinforced Polyester BMC (discontinued **) Description: Premi-Glas® 8102-20 is a glass reinforced thermoset polyester Bulk Molding Compound designed for injection molding of automotive forward lighting reflectors. Key features and benefits:..
Flexural Modulus	12.4 GPa	1800 ksi	ISO 178
SABIC Innovative Plastics LNP Stat-kon DEL339XC PC LNP STAT-KON* DEL339XC is a compound based on Polycarbonate resin containing Carbon Fiber, PTFE, Flame Retardant. Added features of this material include: Electrically Conductive.This data was supp..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Solvay Specialty Polymers TorlonÂ® 4645 Polyamide-imide (PAI) TorlonÂ® 4645, an injection-moldable, wear-resistant grade of polyamide-imide (PAI), has been formulated to give outstanding wear resistance in lubricated wear applications.Features: Flame Retarda..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Sumitomo Bakelite North America RXÂ® 3-1-525F-P Short-Glass Reinforced Diallyl Phthalate Ortho Resin Isomer (DAP). Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.Meets the requirements of ASTM D5948 Type SDG-F.I..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Techmer ES ElectrablendÂ® PA6/6 03004 GF20 Carbon/20% Glass Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Carbon Fiber Reinforcement/Glass Fiber Reinforcement, 20% Filler by WeightAdditive: Lubricant, Impact Modifier and Heat StabilizerFeatu..
Flexural Modulus	12.4 GPa	1800 ksi	Lengthwise; ASTM D790
Bedford Plastics Glass Reinforced Polyester Structural Fiberglass Profiles Pultrusion results in the production and supply of one of the worlds strongest and most durable products available today. The pultruded products feature:High StrengthCorrosion Resistant to many che..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC 1050 Thermoset Polyester BMC 1050 is a cosmetic, appliance grade material with superior heat stability. As with all other BMCI compounds, this Series can be supplied in logs, slugs or bulk.Typical applications are toaster e..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC 200 Thermoset Polyester, Electrical Grade BMC 200 is a high strength, low shrink molding compound. It can be supplied in bulk or extruded in pre-weighted slugs.Typical applications are circuit breakers, insulators, bobbins, electrical conne..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC 945 Conductive Grade Bulk Molding Compound BMC 945 is an ESD level Conductive grade of Bulk Molding Compound and is suitable for compression, transfer and stuffer injection molding. It is characterized by excellent flow and controlled reacti..
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC T12-15526 General Purpose Molding Compound BMC T12-15526 is a general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T12 is well suited for injection, transfer or compression molding of intricate parts. ..
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.Information provided by Sumitomo Bak North America, Inc.
Flexural Modulus	12.4 GPa	1800 ksi	ASTM D790
PolyOne Edgetek® AM 33 GF/000 L HS Black Polyphthalamide (PPA), Glass Filled (discontinued **) Description/Features:Heat StabilizedBlackEnhanced LubricationGlass Fiber ReinforcedInformation provided by PolyOne Corporation.
Flexural Modulus	12.4 - 13.8 GPa	1800 - 2000 ksi
Bulk Molding Compounds BMC T70 Automotive Grade Molding compound BMC T70 is a low profile automotive grade molding compound specifically formulated for the vacuum metallization process. These compounds have excellent physical properties as well as superior adhes..