Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 1.57 GPa | 228 ksi | 50 mm/min; ASTM D 638 |
SABIC Innovative Plastics Lexan® FXE173R PC This data was supplied by SABIC-IP for the Americas region. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics Lexan® SFX173RU PC SFX173RU is a transparent SecurFX grade with high flow, mold release and UV stabilizer. This grade is for security applications and contains proprietary authentication technology. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics Lexan® SFX173RU PC (Asia Pacific) SFX173RU is a transparent SecurFX grade with high flow, mold release and UV stabilizer. This grade is for security applications and contains proprietary authentication technology. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 1 mm/min; ISO 527 |
SABIC Innovative Plastics LNP STAT-KON MX01767C PP LNP* STAT-KON* MX01767C is a compound based on Polypropylene containing Proprietary Filler(s). Added features of this grade include: Electrically Conductive, Clean Compounding System. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 1 mm/min; ISO 527 |
SABIC Innovative Plastics LNP STAT-KON MX10301C PP LNP* STAT-KON* MX10301C is a compound based on Polypropylene containing Proprietary Filler(s). Added features of this grade include: Electrically Conductive, Clean Compounding System. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 5 mm/min; ASTM D638 |
Samsung Cheil Industries Starex® SD-0170 F ABS, Unreinforced Information provided by Samsung Cheil Industries. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 5 mm/min; ASTM D638 |
Samsung Cheil Industries Starex® SD-0170 F ABS, Unreinforced Information provided by Samsung Cheil Industries. |
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Tensile Modulus | 1.57 GPa | 228 ksi | Film M.D.; ASTM D882 |
Eastman Eastman Embrace Copolyester for Extrusion/Cast Film Applications:Flexible packagingIV containersLabels to fit high contour containersShrink packagingWrap around designKey Attributes:Excellent clarityExcellent printabilityGood chemical resistanceGood .. |
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Tensile Modulus | 1.57 GPa | 228 ksi | Storage |
Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot.. |
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Tensile Modulus | 1.57 GPa | 228 ksi | 1 mm/min; ISO 527 |
SABIC Innovative Plastics LNP Stat-kon MX01767C PP LNP* Stat-Kon* MX01767C is a compound based on Polypropylene containing Proprietary Fillers. Charactiers of this grade are Statically Conductive, Clean Compound System.This data was supplied by SAB.. |