Polymer Property : Tensile Modulus = 10.0 ksi Product List

Mechanical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.0689 - 0.103 GPa	10.0 - 15.0 ksi
ITW Plexus Plexusâ„¢ MA3940 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Use with craze sensitive plastics.Information provided by Illinois Tool Works.
Tensile Modulus	0.0689 GPa	10.0 ksi	Molded Properties; ISO 527-2/1
ExxonMobil Escorene™ FL 00212 Ethylene Vinyl Acetate Copolymer (European Grade) Product Description: FL 00212 is a copolymer of ethylene and vinyl acetate. Processing Conditions: Processing temperatures above 260°C (500°F) may cause resin degradation. Machines should always b..
Tensile Modulus	0.0689 GPa	10.0 ksi	ASTM D638
3M Dyneon™ CC085 Custom Fluoropolymer Compound (discontinued **) This compound consists of a mixture of PPS and other proprietary fillers blended with PTFE.Information provided by Dyneon, A 3M Company
Tensile Modulus	0.0689 GPa	10.0 ksi	TM R050-36
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
Tensile Modulus	0.0689 GPa	10.0 ksi	TM R050-36
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Tensile Modulus	0.0689 GPa	10.0 ksi	TM R050-36
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Tensile Modulus	0.0689 GPa	10.0 ksi	TM R050-36
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..