Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | TM R050-36 |
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | TM R050-36 |
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11.. |
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Tensile Modulus | 0.414 - 0.552 GPa | 60.0 - 80.0 ksi | |
ITW Plexus Plexusâ„¢ MA1020 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works. |
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Tensile Modulus | 0.414 - 0.552 GPa | 60.0 - 80.0 ksi | |
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works. |
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Tensile Modulus | 0.414 - 0.552 GPa | 60.0 - 80.0 ksi | |
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works. |
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Tensile Modulus | 0.414 - 0.552 GPa | 60.0 - 80.0 ksi | |
ITW Plexus Plexusâ„¢ MA1025 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, able to be used 1" thick.Information provided by Illinois Tool Works. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM D-882 |
Saint-Gobain Norton® Chemfilm® DF100 Fluoropolymer Cast Film Description: Used for Chemical Process, Electrical/Electronics, Medical, Protective/Decorative. Surface Treatments Available: Chemical Etching (1 or 2 sides). Information provided by Saint Gobain Pe.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM D-882 |
Saint-Gobain Norton® Chemfilm® DF110 Fluoropolymer Cast Film Description: Used for Chemical Process, Electrical/Electronics, Medical, Protective/Decorative.Information provided by Saint Gobain Performance Products. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM D-882 |
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1400 Non-Conductive PTFE Tape Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM D-882 |
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1471 Conductive PTFE Tape Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM D-882 |
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1700 Heat Bondable PTFE Film Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM D-882 |
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1900 Heat Bondable PTFE Film Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | 1 mm/min |
Arkema Group Pebax® 7033 SN 01 Polyether Block Amide (PEBA) (Dry) POLYETHER BLOCK AMIDE (PEBA) hardness 70 shore D Non plasticized flexible Polyamide Outstanding mechanical properties at low temperature (-40°C) Applications: Sport (Football shoe sole, ski top lay.. |
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Tensile Modulus | 0.414 GPa | 60.0 ksi | ASTM C297 |
Touchstone CFOAM® 20 Structural Carbon Foam CFOAM, developed by Touchstone Research Laboratory, Ltd., is a next generation structural material which is inexpensive, lightweight, fire-resistant, impact-absorbing, and which can be thermally ins.. |
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Tensile Modulus | 0.414 - 0.483 GPa | 60.0 - 70.0 ksi | TM R050-36 |
Resinlab® EP1305 Black Highly Toughened Urethane Modified Epoxy Resinlab™ EP1305 Black is a highly toughened urethane modified epoxy designed for bonding PVC, metals, ceramics and other difficult to bond substrates. The system has a thixotropic non-sag viscosi.. |