Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 0.0689 - 0.103 GPa | 10.0 - 15.0 ksi | |
ITW Plexus Plexusâ„¢ MA3940 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Use with craze sensitive plastics.Information provided by Illinois Tool Works. |
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Tensile Modulus | 0.0689 GPa | 10.0 ksi | Molded Properties; ISO 527-2/1 |
ExxonMobil Escorene™ FL 00212 Ethylene Vinyl Acetate Copolymer (European Grade) Product Description: FL 00212 is a copolymer of ethylene and vinyl acetate. Processing Conditions: Processing temperatures above 260°C (500°F) may cause resin degradation. Machines should always b.. |
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Tensile Modulus | 0.0689 GPa | 10.0 ksi | ASTM D638 |
3M Dyneon™ CC085 Custom Fluoropolymer Compound
(discontinued **) This compound consists of a mixture of PPS and other proprietary fillers blended with PTFE.Information provided by Dyneon, A 3M Company |
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Tensile Modulus | 0.0689 GPa | 10.0 ksi | TM R050-36 |
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an.. |
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Tensile Modulus | 0.0689 GPa | 10.0 ksi | TM R050-36 |
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |
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Tensile Modulus | 0.0689 GPa | 10.0 ksi | TM R050-36 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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Tensile Modulus | 0.0689 GPa | 10.0 ksi | TM R050-36 |
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |