Mechanical Properties | Metric | English | Comments |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti.. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the.. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | ABS-ABS |
Master Bond MB297 Cyanoacrylate Adhesive System General purpose, fills gap to 0.008Information provided by Master Bond Inc. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | ABS-ABS |
Master Bond MB300 Cyanoacrylate Adhesive System General purpose wicking grade, fills gap to 0.002Information provided by Master Bond Inc. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | ABS-ABS |
Master Bond MB302 Cyanoacrylate Adhesive System For rubber & plastic bonding, fills gap to 0.005Information provided by Master Bond Inc. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | Lap shear, alum to alum, 4 hrs @ 65°C |
Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound TRA-BOND 2159 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | Lap shear, alum to alum, 10 min @ 100°C |
Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical an.. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | Lap Shear Strength |
Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc. |
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Adhesive Bond Strength | 8.96 MPa | 1300 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an.. |
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Adhesive Bond Strength | 8.96 - 15.9 MPa | 1300 - 2310 psi | Average value: 11.7 MPa Grade Count:3 |
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr.. |