Physical Properties | Metric | English | Comments |
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Viscosity | 1800 - 2100 cP | 1800 - 2100 cP | Thixotropic |
ND Industries NutGrade® 122 Removable Threadlocker A medium strength, oil tolerant threadlocker. Seals most types of nuts and bolts allowing disassembly using standard tools.Typical Usesstuds and bolts, threaded pipe fittings, and locking nuts or b.. |
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Viscosity | 1800 cP | 1800 cP | |
NextGen Adhesives P907-04 Fiber Optic Adhesive Description: NGAC P907-04 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si.. |
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Viscosity | 1800 - 2200 cP @Temperature 82.2 °C |
1800 - 2200 cP @Temperature 180 °F |
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Northstar Polymers MSA-052 Polyester Prepolymer Information provided by Northstar Polymers. |
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Viscosity | 1800 cP @Temperature 25.0 °C |
1800 cP @Temperature 77.0 °F |
at 20 rpm vibration |
Permabond HM118 Anaerobic Threadlocker Permabond® HM118 Threadlocker is an excellent general-purpose threadlocker and sealant. It is used for locking bolts, nuts and screws that require permanent assembly. Cure is fast and reliable on s.. |
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Viscosity | 1800 - 4500 cP | 1800 - 4500 cP | |
Huntsman Araldite GZ 597 KT-55 Bisphenol A Epoxy Solution Weight per Epoxide (EEW, g/eq) 1666 to 2000. Max color is 4.Comments/Applications: GT 7097 - 55% solids in MIBK (22.5%) and toluene (22.5%). For heat cured industrial coatings in combination with .. |
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Viscosity | 1800 - 2200 cP @Temperature 25.0 °C |
1800 - 2200 cP @Temperature 77.0 °F |
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Taiwan PU Corporation TPUA-760 TPU Shoe Adhesive A PU resin for general application with excellent adhesion to all kinds of media.Features: Fast crystallization rateGood initial adhesionGood thermo toleranceCan be used alone or combined with a cro.. |
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Viscosity | 1800 cP @Temperature 25.0 °C |
1800 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond F112 Fiber Optic Epoxy Adhesive TRA-BOND F112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. This .. |
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Viscosity | 1800 cP @Temperature 25.0 °C |
1800 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond F113SC High Tg Fiber Optic Epoxy Adhesive TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lense.. |
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Viscosity | 1800 cP @Temperature 25.0 °C |
1800 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming EP551 Adhesive Clear unfilled adhesive for use with complete range.All information provided by Trelleborg Emerson & Cuming |
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Viscosity | 1800 cP | 1800 cP | Mixed |
Loctite® 3143 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For .. |
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Viscosity | 1800 cP | 1800 cP | Mixed |
Loctite® 3166 Deep Potting Epoxy PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e.. |
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Viscosity | 1800 - 2500 cP | 1800 - 2500 cP | Part A |
Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used.. |
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Viscosity | 1800 - 2000 cP @Temperature 23.0 °C |
1800 - 2000 cP @Temperature 73.4 °F |
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Master Bond UV18S High Strength, Chemically Resistant UV Curable System Master Bond UV18S is a one component, high strength UV curable system with good chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient te.. |
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Viscosity | 1800 cP @Temperature 25.0 °C |
1800 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond F131 High Tg Room Temperature Cure Fiber Optic Adhesive TRA-BOND F131 is a fiber-optic adhesive used for terminating ALL types of fiber-optic connectors as well as LED displays, lenses and other optical components. It produces a typical Tg of 95°C thus .. |
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Viscosity | 1800 - 5000 cP | 1800 - 5000 cP | Thixotropic |
Loctite® 262 Medium to High Strength Threadlocker ThreadlockersInvented by Loctite Corporation as a revolutionary method to lock and seal threaded fasteners, Loctite® Liquid Threadlockers have found wide acceptance in a range of applications--from.. |
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Viscosity | 1800 - 2400 cP | 1800 - 2400 cP | NOV QC 020 |
Lubrizol ESTANE® 5735 Ester Based Thermoplastic Polyurethane (European Grade) Description: Estane® thermoplastic polyurethanes (TPUs) include elastomeric materials that bridge the gap between flexible rubber and rigid plastics. These materials offer toughness and durability .. |
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Viscosity | 1800 - 3300 cP @Temperature 23.0 °C |
1800 - 3300 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info.. |
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Viscosity | 1800 - 3600 cP @Temperature 23.0 °C |
1800 - 3600 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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Viscosity | 1800 - 3600 cP @Temperature 23.0 °C |
1800 - 3600 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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Viscosity | 1800 - 2800 cP @Temperature 23.0 °C |
1800 - 2800 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two .. |
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Viscosity | 1800 cP | 1800 cP | |
Dow PAPI™ 20 Polymeric MDI PAPI™ 20 polymeric MDI is a polymethylene polyphenylisocyanate that contains MDI. This product`s functionality value of 3.2 and high viscosity result in highly rigid foams. This product is design.. |
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Viscosity | 1800 cP | 1800 cP | |
ACC EP MAP-Z 14 EPI Engineered Polymers Aliphatic Polymer EP MAP Z, “Powered by Reactamine® Technology”, are zinc modified aliphatic prepolymers with monomer-extracted levels of a maximum of 0.2%. The polymers are made from HDI. Three products are avail.. |
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Viscosity | 1800 cP | 1800 cP | B Component; ASTM D1824 |
Aptek 2210A/B Electrically conductive urethane adhesive Electrically conductive urethane adhesive, silver-filled, flexible low modulus, low outgassingAPTEK 2210-A/B is a two component, silver-filled, urethane adhesive designed for application where flexi.. |
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Viscosity | 1800 cP | 1800 cP | |
Atom Adhesives AA-BOND F112 Epoxy Adhesive AA-BOND F112 is an impact resistant, fiber-optic adhesive. AA-BOND F112 is two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. AA-BOND F.. |
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Viscosity | 1800 cP | 1800 cP | uncured |
Atom Adhesives AA-BOND F253 Epoxy Adhesive AA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status.Appearance: Unmixed-Light Yellow; Mixed – Greenish.. |