Physical Properties | Metric | English | Comments |
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Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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Viscosity | 11000 - 15000 cP @Temperature 25.0 °C |
11000 - 15000 cP @Temperature 77.0 °F |
Of resin |
Resin Technology Group TIGA 101-EX Five-Minute Epoxy Adhesive 1 part resin to 1 part hardener.TIGA 101-EX is an exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, t.. |
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Viscosity | 11000 cP @Temperature 175 °C |
11000 cP @Temperature 347 °F |
Automatic orifice Viscosity |
Cookson Group Plaskon® PPF-165A Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Lo.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | |
Huntsman Araldite GY 6010 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 182 to 192. Max color is 1.Comments/Applications: Unmodified basic liquid epoxy resin based on bis A and epichlorohydrin. General purpose, highly versatile resin for.. |
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Viscosity | 11000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake Viscosity |
Gwent Electronic Materials C2050425D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and .. |
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Viscosity | 11000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2060217P3 Lead-free Silver Topcoat Ink This product is a Lead free version of C70709D21. Silver Ink C2060217D3 is designed as a top coat for Silver Zinc Ink C2061103D7 printed on PTC ceramics. Screen Printing Equipment: semi-automatic, m.. |
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Viscosity | 11000 - 16000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 16000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2061103D7 Lead free Silver Zinc Basecoat Paste This product is a lead-free version of C70709D22. The ink is designed as a screen printing ink for coating Barium Titanate PTC ceramics as the base layer of a two part system. The dried film should.. |
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Viscosity | 11000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials G2020520D1 Gold Metallo-Organic Ink This is a screen printing ink designed to act as a working electrode when fired onto alumina substrates. This unique MO formulation gives a fired thickness in the order of 0.2 to 0.3 microns. This.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV11 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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Viscosity | 11000 cP | 11000 cP | |
Momentive Performance Materials RTV8112 Silicone Rubber Compounds for Potting, Encapsulating and Sealing RTV8111, RTV8112 and RTV8262 silicone rubber compounds are two-part silicone elastomers supplied in ready-to-use matched kits containing a base compound and curing agent.Mechanical and electrical pr.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV8112 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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Viscosity | 11000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
11000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7070-1000 TPE Product Description: StarMediflex P 7070-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part A |
Master Bond EP38CL Adhesive Features Toughness and Durability Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Eccobond® 927-10 E Needle Bonding Epoxy Adhesive Emerson & Cuming 927-10 E Eccobond® Needle Bonding Epoxy AdhesiveOne component, fast curing, epoxy adhesive for needle bonding with polypropylene hubs. Also recommended for bonding sealing or insul.. |
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Viscosity | 11000 cP | 11000 cP | |
Loctite® PRISM® 4212 Instant Adhesive Gel Cyanoacrylate Bonding AdhesivesLoctite® technology has made the productivity promises of cyanoacrylate adhesives a reality with the industry's widest selection of high-performance, application-.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
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Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | |
3M Scotch-Weld™ 183 B/A Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flowable product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent e.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | 50-3 |
Abatron AboCast 50-3/AboCure 50-1 Epoxy Data provided by the manufacturer, Abatron, Inc. Honey viscosity, light amber color. Best combination of high strength and versatility for Abatron "VR" Epoxies. Shelf life is 12+ months.Processin.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | 50-3 |
Abatron AboCast 50-3/AboCure 50-12 Epoxy Data provided by the manufacturer, Abatron, Inc. Light motor oil viscosity, almost colorless. Shelf life is 12+ months. |
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Viscosity | 11000 cP @Temperature 177 °C |
11000 cP @Temperature 350 °F |
Typical |
Bostik 6327 Color Blending, Low Viscosity, Flexible EVA Glue Stick Bostik 6327 Color Blending, Low Viscosity, Flexible EVA Glue StickAdhesive color blends with substrate. Flexible, no cracking. Low viscosity. Easy to gun. |
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Viscosity | 11000 cP | 11000 cP | |
ACC QSil 40 QSI Quantum Silicones 40 Durometer Condensation Cure for Potting QSil 40 is a general purpose two-part, room temperature, condensation cure siloxane elastomer. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by weight. Cure speed.. |
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Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | Uncured, after Mixing |
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting .. |
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Viscosity | 11000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
11000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarFlex® P 7175-1000 TPE Product Description: StarFlex P 7175-1000 is an easy processing TPE designed for injection molding Features:Soft TouchRubbery FeelExcellent ColorabilityGood WeatherabilityFDA and medical grades avai.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | 50-3 |
Abatron AboCast 50-3/AboCure 50-17 Epoxy Data provided by the manufacturer, Abatron, Inc. Very low-viscosity; Dark Amber color. Shelf life is 12+ months. |