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Polymer Property : Thermal Conductivity = 0.231 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.231 W/m-K

@Temperature 1090 °C
1.60 BTU-in/hr-ft²-°F

@Temperature 2000 °F
Thermal Ceramics Kaowool HD Low Temperature Board
Kaowool HD is a low cost high strength product recommended for tough mechanical stress areas. Also, very good for back-up behind dense refractories.Features: Excellent thermal conductivity Capabilit..
Thermal Conductivity 0.231 - 0.245 W/m-K

@Temperature 816 °C
1.60 - 1.70 BTU-in/hr-ft²-°F

@Temperature 1500 °F
ASTM C201
Thermal Ceramics TC-23 Low Temperature Insulating Firebrick
Thermal Ceramics was first to introduce insulating firebrick (IFB) to the industry in the 1930’s. The IFB are manufactured with a slurry casting process which creates a network of microporosity whi..
Thermal Conductivity 0.231 W/m-K

@Temperature 260 °C
1.60 BTU-in/hr-ft²-°F

@Temperature 500 °F
ASTM C201
Thermal Ceramics TC-26 High Temperature Insulating Firebrick
The bond developed is a ceramic bond that is formed by high temperature firing. This produces bricks that are very stable and strong at temperatures higher than 2600°F (1427°C). Features:High temp..
Thermal Conductivity 0.231 W/m-K

@Temperature 816 °C
1.60 BTU-in/hr-ft²-°F

@Temperature 1500 °F
ASTM C201
Thermal Ceramics IFB 23 Tile Low Temperature Insulating Firebrick
Thermal Ceramics was first to introduce insulating firebrick (IFB) to the industry in the 1930’s. The IFB are manufactured with a slurry casting process which creates a network of microporosity whi..
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