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UBE UPILEX 75S (75 micron) Polyimide Film

Category Polymer , Film , Thermoset , Polyimide, TS , Polyimide, Thermoset Film
Manufacturer UBE
Trade Name UPILEX
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF UBE UPILEX 75S (75 micron) Polyimide Film.pdf
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Material Notes:
Description: UPILEX, the ultra-high heat-resistant polyimide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which process Ube Industries originally developed, and diamine. Most notable of these characteristics is UPILEX's physical, mechanical, electrical, and chemical properties under high-temperature conditions.UPILEX-S demonstrates outstanding mechanical characteristics through a wide temperature range. UPILEX-S displays high tensile strength and modulus, and also features outstanding long-term heat resistance. Another advantage inherent in UPILEX-S is its high resistance to hydrolysis, as its properties are practically unaffected, even by immersion in boiling water for long periods of time.Information provided by UBE.
Physical Properties Metric English Comments
Density 1.47 g/cc
0.0531 lb/in³
ASTM D1505
Mechanical Properties Metric English Comments
Film Tensile Strength at Yield, MD 107.9 MPa
15650 psi
200°C (Stress at 5% Elongation (MD)); ASTM D882
205.9 MPa
29860 psi
25°C (Stress at 5% Elongation (MD)); ASTM D882
Film Elongation at Break, MD 50 %
50 %
25°C; ASTM D882
80 %
80 %
200°C; ASTM D882
Secant Modulus, MD 3.82 GPa
554 ksi
200°C; ASTM D882
6.96 GPa
1010 ksi
25°C; ASTM D882
Coefficient of Friction, Dynamic 0.40
0.40
25°C, film to film; ASTM D1894
Tear Strength Test 30
30
kg/mm, 25°C Tear Strength-Initiation [Graves] (MD); ASTM D1004
430
430
g/mm, 25°C, Tear Strength-Propagation [Elmendorf] (MD); ASTM D1922
Film Tensile Strength at Break, MD 274.6 MPa
39830 psi
200°C; ASTM D882
362.8 MPa
52620 psi
25°C; ASTM D882
Thermal Properties Metric English Comments
CTE, linear 20.0 µm/m-°C

@Temperature 20.0 - 200 °C
11.1 µin/in-°F

@Temperature 68.0 - 392 °F
Values determined by minute linear expansion tester at 5°C/min. temperature increments
Specific Heat Capacity 1.13 J/g-°C
0.270 BTU/lb-°F
Differential Scanning Calorimeter
Thermal Conductivity 0.289 W/m-K
2.00 BTU-in/hr-ft²-°F
Laser Flash Method
Maximum Service Temperature, Air 290 °C
554 °F
Heat Treatment: 20,000 Hours
Glass Transition Temp, Tg >= 500 °C
>= 932 °F
Flammability, UL94 V-0
V-0
VTM
Oxygen Index 66 %
66 %
JIS K7201
Shrinkage 0.0100 %

@Temperature 200 °C,
Time 7200 sec
0.0100 %

@Temperature 392 °F,
Time 2.00 hour
JIS C2318
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm

@Temperature 25.0 °C
1.00e+16 ohm-cm

@Temperature 77.0 °F
DC100V; ASTM D257
1.00e+16 ohm-cm

@Temperature 200 °C
1.00e+16 ohm-cm

@Temperature 392 °F
DC100V; ASTM D257
Surface Resistance 1.00e+15 ohm

@Temperature 200 °C
1.00e+15 ohm

@Temperature 392 °F
DC100V; ASTM D257
>= 1.00e+16 ohm

@Temperature 25.0 °C
>= 1.00e+16 ohm

@Temperature 77.0 °F
DC100V; ASTM D257
Dielectric Constant 3.3

@Frequency 1000 Hz
3.3

@Frequency 1000 Hz
ASTM D150
3.2

@Frequency 1000 Hz,
Temperature 200 °C
3.2

@Frequency 1000 Hz,
Temperature 392 °F
ASTM D150
Dielectric Strength 150 kV/mm

@Temperature 25.0 °C
3810 kV/in

@Temperature 77.0 °F
50Hz, 75µm; ASTM D149
150 kV/mm

@Temperature 200 °C
3810 kV/in

@Temperature 392 °F
50Hz, 75µm; ASTM D149
Dissipation Factor 0.0038

@Frequency 1000 Hz
0.0038

@Frequency 1000 Hz
ASTM D150
0.0056

@Frequency 1000 Hz,
Temperature 200 °C
0.0056

@Frequency 1000 Hz,
Temperature 392 °F
ASTM D150
Descriptive Properties Value Comments
Folding endurance [MIT] Min 25,000 Cycles
ASTM D2176, 25°C
Resistance to Organic Solvents Excellent
Resistance to Strong Acids Good
Resistance to Strong Alkalis Good
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